以Ti_3AlC_2和Cu粉作为原料,在1150 ℃下原位热压反应制备了具有亚微米层状结构的Ti_3C_2/(Cu-Al)金属陶瓷材料.XRD、SEM和TEM分析表明,这种亚微米层状结构的形成,归因于Ti_3AlC_2与Cu的高温反应引发Ti_3AlC_2层状结构解离、Al原子溶脱,固溶入周围的Cu中形成Cu-Al固溶体,Al溶出后的Ti_3AlC_2中原始Ti_3C_2层规律性聚集、最终形成厚度为150 nm左右的Ti_3C_2层与Cu-Al层交替层叠结构.由于这两种结构之间的牢固结合以及Cu-Al相构成的空间网络结构,使得此金属陶瓷材料具有优异的力学性能和电学性能.其抗弯强度超过1200 MPa,并具有良好的断裂韧性和导电性.
A sub-micro-layered Ti_3C_2/(Cu-Al) cermet was prepared by in-situ hot pressing a mixture of Ti_3AlC_2 and copper powders. The reaction behaviors and microstructures of the cermet were investigated by XRD, SEM and TEM. It was revealed that the molten Cu accelerated Ti_3AlC_2 to decompose, induced the interfacial exfoliation to generate, and consequently formed a sub-micro-layered structure making up of Ti_3C_2 layers and Cu-Al alloy layers within one Ti_3AlC_2 grain. This interfacial exfoliation behavior can be attributed to a topotactic mechanism due to the outward diffusion of Al and the entering of Cu. The removed Al atoms entered into Cu matrix to form Cu-Al alloy. Thus, a sub-micro-layered Ti_3C_2/(Cu-Al) cermet was fabricated. Both the widths of the Ti_3C_2 layer and Cu-Al layer were ～150 nm. The cermets have excellent mechanical and electrical properties, due to the strong interface bond between Ti_3C_2 layer and Cu-Al alloy layer. The flexural strength of the cermets with the original Ti_3AlC_2 volume content of 40%, 50% and 60% was as high as 1105.13, 1241.96 and 1229.06 MPa, respectively. Correspondingly, the fracture toughness was 15.91, 12.87 and 10.62 MPa.m~(1/2), respectively.
参考文献
| [1] | Deshpande P K;Li J H;Lin R Y .[J].Materials Science and Engineering A,2006,429:58. |
| [2] | Zarrinfar N;Kennedy A R;Shipway P H .[J].Scripta Materialia,2004,50:949. |
| [3] | Lee Y F;Lee S L;Lin J C .[J].Scandinavian Journal of Metallurgy,1999,28:9. |
| [4] | Barsoum M W .[J].Progress in Solid State Chemistry,2000,28:201. |
| [5] | Zhai H X;Ai M X;Huang Z Y.[J].Key Engineering Materials,2007(336-338):1394. |
| [6] | Ai M X;Zhai H X;Tang Z Y.[J].Key Engineering Materials,2007(336-338):1371. |
| [7] | Huang Z Y;Zhai H X;Ai M X.[J].Key Engineering Materials,2007(336-338):1436. |
| [8] | Ai MX;Zhai HX;Zhou Y;Tang ZY;Huang ZY;Zhang ZL;Li SB .Synthesis of Ti3AlC2 powders using Sn as an additive[J].Journal of the American Ceramic Society,2006(3):1114-1117. |
| [9] | Eremenko V N;Fisenko V N.The Role of Surface Phenomena in Metallurgy[M].New York:Consultants Bureau,1963:117. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%