THE INFLUENCES OF SOLUTION PH AND CURRENT DENSITY ON COERCIVITY OF ELECTROPLATING CoNdNiMnP PERMANENT MAGNETIC ALLOY FILM ARRAYS

金属学报(英文版), 2004, 17(5): 677-681.

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1.School of Microelectronics and Solid Electronics, University of Electronic Science and Technology of China,Chengdu 610054, China

2.School of Microelectronics and Solid Electronics, University of Electronic Science and Technology of China,Chengdu 610054, China

3.School of Microelectronics and Solid Electronics, University of Electronic Science and Technology of China,Chengdu 610054, China

4.School of Microelectronics and Solid Electronics, University of Electronic Science and Technology of China,Chengdu 610054, China

5.School of Microelectronics and Solid Electronics, University of Electronic Science and Technology of China,Chengdu 610054, China

6.School of Microelectronics and Solid Electronics, University of Electronic Science and Technology of China,Chengdu 610054, China

THE INFLUENCES OF SOLUTION PH AND CURRENT DENSITY ON COERCIVITY OF ELECTROPLATING CoNdNiMnP PERMANENT MAGNETIC ALLOY FILM ARRAYS

Keywords： solution PH

The influences of plating bath solution PH and current density on coercivity of electroplating CoNdNiMnP permanent magnetic film arrays were studied. The experiment results show that both for solution PH and current density there were the best depositing parameters. Too high and too low plating bath solution PH or current density both result in decreasing of the film array coercivity. When solution PH is 3.5 and current density is 5mA/cm2, the prepared film array coercivity can reach the maximum.

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THE INFLUENCES OF SOLUTION PH AND CURRENT DENSITY ON COERCIVITY OF ELECTROPLATING CoNdNiMnP PERMANENT MAGNETIC ALLOY FILM ARRAYS

参考文献