采用复合铸造方法制备了银包铜复合材料，研究了扩散退火温度和时间对复合材料显微组织和扩散层厚度的影响。结果表明：随着扩散热处理温度升高和保温时间的延长，扩散层厚度逐渐增加，在500℃和600℃保温60 min，出现了界面组织的球化现象。扩散层厚度与扩散处理时间的平方根成正比，扩散层生长激活能为51.9 kJ/mol。
The Ag clad Cu composite materials were prepared by the method of composite casting. The influences of diffusion annealing temperature and annealing time on microstructures and thickness of diffusion layer were studied. The results show that thickness of diffusion layer increased with the increasing temperature and time. The interface structure appears phenomenon like spheroidizing structure at 500℃ and 600℃ for 60 min. The thickness of diffusion layer is proportional to the square root of time and the growth activation energy of diffusion layer is about 51.9 kJ/mol.
参考文献
| [1] | 朱建芳,龚富华.镀银铜线的银层厚度与银质量分数换算[J].光纤与电缆及其应用技术,2009(03):5-11. |
| [2] | 李学俊.提高镀银铜线质量的要点[J].电线电缆,1996(1):47-48. |
| [3] | 孟亮,周世平,杨富陶,沈其洁,刘茂森.轧制及扩散温度对Ag/Cu层状复合材料结合性能的影响[J].中国有色金属学报,2001(06):982-987. |
| [4] | 陈燕俊,孟亮,周世平,杨富陶,林德仲.不同温度下Ag/Cu复合界面的扩散处理[J].材料科学与工程,2001(01):56-59,38. |
| [5] | 王志兴;赖祖洒;刘国禄 等.Ag-Cu 复合材料界面结构和强度的研究[J].金属学报,1983,19(5):410-416. |
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