微胶囊型自修复复合材料设计的关键是基体材料和胶囊壳体材料的断裂韧性要在一定的范围内,使得基体材料的断裂特性和胶囊壳体材料的断裂特性达到最佳的匹配,这样才能保证自修复过程的实现.为得到这种匹配关系,首先对环氧树脂、不饱和聚酯和尼龙等基体材料试件进行了断裂韧性测定.然后从上述基体材料中以不同的材料组合制备出9种组配的夹层试件,每种组配所选用的两种材料(基体材料和夹层材料)的KIC值有差值ΔK IC.实验表明,在同样界面强度条件下,当基体材料和夹层材料的断裂韧性差值ΔKIC＜89669Pa·m1/2时,裂纹绕过夹层;而当ΔKIC＞89669Pa·m1/2时,裂纹穿过夹层.对模拟胶囊试件的实验验证了上述结论的正确性.
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