欢迎登录材料期刊网

材料期刊网

高级检索

结合扫描电镜形貌观察和能谱分析研究了AlCl3-NaCl-KCl低温无机熔盐体系中电镀铝时电流密度对Q235钢基体上铝晶粒沉积形貌的影响,并从铝晶粒沉积过程中总的自由能变化的角度对其析出规律进行探讨。结果表明,在由80%AlCl3+10%NaCl+10%KCl所组成的熔盐中,当温度为150℃、电流密度为20.0~98.7 mA/cm2范围内电镀时,均可在Q235钢表面上获得完整、致密的铝镀层。电流密度的大小直接影响铝晶粒的形态和尺寸。电流密度低时,铝晶粒呈片状;电流密度高时,铝晶粒呈颗粒状,且随电流密度的增大,铝晶粒尺寸呈现减小趋势。结合热力学和动力学探讨了电流密度大小对电镀铝晶粒尺寸及形貌的影响。电流密度对铝晶粒形貌的影响与铝晶粒在Q235钢基体上沉积时形核及长大过程中的总自由能变化,特别是由电流密度大小所决定的铝晶核析出电化学能的大小有关。

参考文献

[1] 杨宝刚,邱竹贤.熔盐电镀铝和铝合金[J].有色矿冶,1998(04):43-46.
[2] M. JAFARIAN;M. G. MAHJANI;F. GOBAL .Electrodeposition of aluminum from molten AlCl_3-NaCl-KCl mixture[J].Journal of Applied Electrochemistry,2006(10):1169-1173.
[3] 杨占红,王小花,陈建华,李旺兴,周韶峰,周跃华.无机熔盐中脉冲铝镀层的研究[J].轻金属,2007(06):62-64.
[4] 冯秋元,丁志敏,贾利山,关君实.低温熔融盐电镀铝的研究[J].材料保护,2004(04):1-3.
[5] WANG Yu-jiang;MA Xin-xin;GUO Guang-wei .Electrodeposition of aluminum on 316L stainless steel from molten salts based on chlorides[J].Key Engineering Materials,2008,373-374:273-276.
[6] Jafarian M;Mahjani MG;Gobal F;Danaee I .Effect of potential on the early stage of nucleation and growth during aluminum electrocrystallization from molten salt (AlCl3-NaCl-KCl)[J].Journal of Electroanalytical Chemistry: An International Journal Devoted to All Aspects of Electrode Kinetics, Interfacial Structure, Properties of Electrolytes, Colloid and Biological Electrochemistry,2006(2):190-196.
[7] Grjotheim K;M atiaovsk K .Some problems concerning aluminum electroplating in molten salts[J].Acta Chemica Scandinavica Series A:Physical and Inorganic Chemistry,1980,34(09):666-670.
[8] 冯秋元,丁志敏.熔融盐电镀铝的研究进展[J].电镀与环保,2003(05):1-4.
[9] 宋国泰;牛洪军;孙一唐 等.黄铜熔盐电解沉积铝工艺研究[J].吉林工业大学学报,1992,22(03):114-118.
[10] Nayak B;Misra M M .The elcctrodeposition of aluminum on brass from a molten aluminum chloride-sodium chloride bath[J].Journal of Applied Electrochemistry,1977,7(01):45-50.
[11] Li Q F;Hjuler H A;Berg R W et al.Electrochemical deposition of aluminum from NaC1-A1C13 melts[J].Journal of the Electrochemical Society,1990,137(02):593-597.
[12] Grjotheim Kai;MatiaovskKamil .Some problems concerning aluminium electroplating in molten salts[J].Acta Chemica Scandinavica Series A:Physical and Inorganic Chemistry,1980,34(09):666-670.
[13] 牛洪军;孙国恩;宋国泰 .A1C13一NaCI熔盐电镀铝及其耐蚀性[J].腐蚀与防护,1994,15(02):61-63.
[14] Fellner P;Chrenkovr-Paufrove M;Matiaovsk K .Electrolytic aluminum plating in molten salt mixtures based on A1CI3 I:influence of the addition of tetramethylammonium chloride[J].Surface Technology,1981,14(02):101-108.
[15] Chrenkove-Pauelrove M;Fellner P;Silny A et al.Electrolytic aluminum plating in molten salt mixtures based on AIC13 II:influence of the application of the pulsed current and of a copper underlayer[J].Surface Technology,1982,16(01):15-21.
[16] Nayak B;Misra M M .The electrodeposition of aluminum on mild steel from a molten aluminum chloride/sodium chloride bath[J].Journal of Applied Electrochemistry,1979,9(06):699-706.
[17] Paunovic M;Schlesinger M.Fundamentals of Electrochemical Deposition[M].John Wiley and Sons,Inc,Hoboken,New Jersey,1995
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%