欢迎登录材料期刊网

材料期刊网

高级检索

利用复合结构原理,研制出“硼硅玻璃+α-石英+硅酸锌”系低烧低介陶瓷材料,利用XRD、HP4194频谱仪、SEM分析了该材料的晶相组成、介电性能及显微结构.结果表明:在高频下,该材料具有很低的介电常数(=4~5,1MHz)和很低的介电损耗(tanδ<0.001,1MHz);同时能在低于900℃温度下烧结.该材料是一种理想的适用于高频(1GHz以上)多层片式电感(MLCIs)元件用的介质材料.同时得出:在该组成中,硼硅玻璃重烧结的过程中有方石英析出;少量硅酸锌由于锌离子进入玻璃中而转变为亚硅酸锌;硅酸锌在该组成中有助烧结的作用,该材料介电性能随频率的变化与德拜方程的描述基本吻合.

The low temperature sintering and low dielectric properties ceramic materials of “borosilicate glass+
alpha-quartz+zinc silicate” system were prepared by applying the principle of the componund structure. The crystal phases, dielectric properties and
microstructure of the all sintering samples were analyzed by X-ray diffraction (XRD), HP4194ALCR analyzer and scanning electron microscopy
(SEM) respectively. The results show these materials possess very low dielectric constant (K=4~5, 1MHz)and very low dissipation factor
(tanδ<0. 001, 1MHz)in high frequencies. And they can be sintered below 900℃. These materials are promising dielectric materials
for high frequencies(≥1GHz) mulitlayer chip inductors (MLCIs). In the mean while, new crystalline phase of cristobalite is formed during
re-sintering the borosilicate glass and ZnSiO_3 phase is formed from zinc silicate visa zinc ions melting into the glass net. Zinc silicate
phase is of an aid-sintering function. The changes of dielectric properties of the samples with frequencies are fit with Debye equation.

参考文献

[1] Charles R J, Achuta A R. Ferrite composite containing silver metallization, U. S. Pat. No. 4966625, 1990.
[2] Fujimoto M. J. Am. Ceram. Soc., 1994, 77 (11): 2873--2878.
[3] Hsu J Y, Lin H C, Shen H D, et al. J. IEEE Trans. Magn., 1997, 33 (5): 3325--3327.
[4] Luo L H, Zhuo H P, Zha Zh, et al. J. Mater. Sci.: materials in electronic engineering. 2001, 12: 371--375.
[5] Yu Z X, Zhuo J, Zhang H G, et al. Mater. Lett., 2000, 19: 213--215.
[6] Knickerbocker S H, Kumar A H, Herron L W. Am. Ceram. Soc. Bull., 1993, 72 (1): 90--95.
[7] Chang C R, Jean J H. J. Am. Ceram. Soc., 1999, 82 (7): 1725--1732.
[8] Kumar A H, McMillan P W, Tummala R R. Glass-ceramic structure and sintered multilayered substrates thereof with circuit patterns of gold, silver, or copper, U. S. Pat. No. 4301324, 1981.
[9] Tummala R R. J. Am. Ceram. Soc., 1991, 74: 895--908.
[10] Sasaki M, Okawa H, Suzuki Y, et al. Non-magnetic ceramics and ceramic mulitlayer parts, U. S. Pat. No. 6008151, 1999.
[11] Kingery W D, Bowen H K, Uhlmann D R. Introduction to ceramics, 2nd edition, New York: 87.
[12] Jean J H, Lin SH C, Chang CH R. IEEE Transaction on component: Packaging and Manufacture Technology-part B, 1995, 18(4): 751--754.
[13] 关振铎,张中太,焦金生. 无机材料物理性能. 北京: 清华大学出?版社, 325.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%