利用SEM、XRD等方法研究了0.1 T低稳恒磁场对锡锌合金液/铜片和锡锌铜舍金液/铜片的界面反应过程中金属间化合物(IMC)层的生长、晶体取向以及形貌的影响.结果表明:界面IMC层的厚度随反应时间的延长而增加;在0.1 T磁场下,锡锌合金液/铜片和锡锌铜合金液/铜片的界面IMC层的生长均受到抑制;同时磁场抑制了IMC晶粒的粗化,使IMC颗粒更加细小致密;0.1 T磁场抑制了锡锌合金液/铜片界面处Cu5Zn8(330)的取向度,但对锡锌铜合金液/铜片的界面晶粒取向度影响并不很明显.
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