(Ti,Al)N films were fabricated by arc ion plating (AIP) and then annealed within a range of temperatures from 200 to 500°C for 30 min in vacuum. The results indicate that the average residual stresses decrease slightly from −5.84 to −4.98 GPa with increasing annealing temperature. The stress depth distribution evolves from a sharp ``bell" shape to a mild ``bell" shape, suggesting a more uniform stress state in the annealed films. The microstructure of the films was also investigated in detail. The as-deposited film consists of fine columnar crystals with an amorphous phase at the interface. During heat treatment, the columnar subgrain growth was observed; meanwhile, the phenomenon of crystallization has been identified at the interface. Further more, the relationship between the residual stresses and the microstructure of the films was explored and highlighted. In addition, there is no hardness degradation of the films during heat treatment.
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