目前，少有Cu—Ni-P合金电沉积的研究报道，为此，采用电沉积法制备了Cu．Ni．P镀层，通过循环伏安法考察了铜在Cu—Ni—P镀液中的电化学行为，在此基础上，采用恒电位电沉积法在柠檬酸体系中制备了cu—Ni—P2-元合金镀层，并对镀层的形貌和硬度进行了表征。结果表明：不能单独与铜共沉积的非金属元素P，在一定的工艺条件下，通过在有铜离子的溶液中与镍的诱导共沉积，可以与铜形成Cu．Ni-P合金镀层；Cu．Ni—P合金镀层形貌良好，硬度比Cu镀层有显著提高。
参考文献
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