高体积分数的SiCp/Al复合材料和高Si含量Al-Si合金具有高导热、膨胀系数可调、低密度等特性,成为理想的电子封装材料.结合笔者的研究成果,详细介绍了目前国内外该材料的制备工艺及应用情况,指出了各工艺方法在规模化商业生产中存在的不足,展望了未来研究及发展的方向.
参考文献
| [1] | Zhang Qiguo;Zhang Hongxiang;Gu Mingyuan.Studies on the fracture and flexural strength of Al/Sip composite[J].Materials Letters,2004(58):3545. |
| [2] | Molina J M;Pinero E;Narciso J et al.Liquid metal infiltration into ceramic particle preforms with bimodal size distributions[J].Current Opinion in Solid State and Materials Science,2005,9:202. |
| [3] | Hogg SC;Lambourne A;Ogilvy A;Grant PS .Microstructural characterisation of spray formed Si-30Al for thermal management applications[J].Scripta materialia,2006(1):111-114. |
| [4] | CPS Corporation,Mark A.Occhionero,Richard W.Adams.铝碳化硅为电子封装提供热管理解决方案[J].电子产品世界,2004(20):84-86. |
| [5] | 刘正春,王志法,姜国圣.金属基电子封装材料进展[J].兵器材料科学与工程,2001(02):49-53. |
| [6] | Robert RIrving.Packaged for the Road[M].ASME,2001 |
| [7] | 黄强,顾明元,金燕萍.电子封装材料的研究现状[J].材料导报,2000(09):28-32. |
| [8] | 黄强,金燕萍,顾明元.电子封装用金属基复合材料的制备[J].材料导报,2002(09):18-19,17. |
| [9] | 王文明,潘复生,鲁云,曾苏民.P/M制备SiCp/Al复合材料的研究现状[J].粉末冶金技术,2004(06):364-368. |
| [10] | [OL].http://www.inseto.co.uk/products/micromaterials/polese-heatsinkcompositemetals.shtml |
| [11] | 王晓阳,朱丽娟,刘越.粉末冶金法制备AlSiC电子封装材料及性能[J].电子与封装,2007(05):9-11,15. |
| [12] | Miracle D B .Metal matrix composites-From science to technological significance[J].Journal of Computer Science and Technology,2005,65(15-16):2526. |
| [13] | [OL].http://thermaltc.com/technologies.heml |
| [14] | Aghajanian .Method of forming metal matrix composite bodies by a spontaneous infiltration process,and products produced therefrom[P].US 5249621,1993-10-05. |
| [15] | 曲选辉;何新波;任淑彬 等.制备高体积分数碳化硅颗粒增强铝基复合材料零件方法[P].CN 200510011102.4,2005-10-01. |
| [16] | 顾明元;张其国 .高体积分数硅颗粒增强铝基复合材料的制备方法[P].CN 200510024032.6,2005-10-02. |
| [17] | Rao B S;Jayaram V .Pressureless infiltration of Al-Mg based alloys into Al2 O3 preforms:mechanisms and phenomenology[J].Acta Materials,2001,49:2373. |
| [18] | 刘贯军,李文芳,杜军.铝、镁基复合材料的润湿性探究[J].铸造,2006(09):911-915. |
| [19] | 崔华,郝斌,张济山.金属基复合材料制备中有害界面反应的控制和润湿性的改善工艺[J].铸造,2006(08):817-820. |
| [20] | Shi Zhongliang;Shijiro Ochiai;Masaki Hojo .Joining characteristics of oxidized SiC particles reinforced Al-Mg matrix composite prepared by reaction infiltration processing[J].Journal of Materials Research,2001,16(02):400. |
| [21] | Hemambar Ch;Rao B S;Jayaram V .Al-SiC electronic packages with contolled thermal expansion coefficient by a new method of pressureless infiltration[J].Materials and Manufacturing Processes,2001,16(06):779. |
| [22] | Rodriguez-Reyes M;Pech-Canul M I;Lopez-Cuevas J et al.Limiting the development of Al4 C3 to prevent degradation of Al/SiCp composites processed by pressureless infiltration[J].Journal of Computer Science and Technology,2006,66:1056. |
| [23] | Aguilar-Martinez J A;Pech-Canul M I;Rodriguez-Reyes M et al.Effect of processing parameters on the degree of infiltration of SiCp performs by Al-Si-Mg alloys[J].Materials Letters,2003,57:4332. |
| [24] | Ortega-Celaya F;Pech-Canul M I;Lopez-Cuevas J.Microstructure and impact behavior of Al/SiCp composites fabricated by pressureless infiltration with different types of SiCp[J].Journal of Materials Processing Technology,2006(10):1016. |
| [25] | Lee H S;Hong S H .Pressure infiltration casting process and thermophysical properties of high wolume fraction SiCp/Al metal metrix composites[J].Materials Science and Technology,2003,19:1057. |
| [26] | Asthana R.Solidification Processing of Reinforced Metals[M].Switzerland:Trans Tech Publications Ltd,Switzerland,1998 |
| [27] | Mark A Occhionero;Robert A Hay;Richard W Adams.Cost-effective manufacturing of aluminum silicon carbide electronic packages[A].,1999:118. |
| [28] | 童震松,沈卓身.金属封装材料的现状及发展[J].电子与封装,2005(03):6-15. |
| [29] | Mark A Occhionero;Richard W Adams.AlSiC and AlSiC hybrid composites for flip chips,optoelectronics,power and high brightness LED thermal management solutions[A].,2005:576. |
| [30] | [OL].http://www.matweb.com/reference/MetalMatrixComposite.aspx |
| [31] | [OL].http://www.ametekmetals.com/products/sku.cfm?ProductCAtegory_Id=4293&Product_Id=1312&SKU_Id=1787 |
| [32] | [OL].http://smt.pennnet.com/Articles/ArticleDisplay.cfm?Section=Articles&Subsection=Display&ARTICLEID=229921 |
| [33] | [OL].http://www.alsic.cn/chinese/c_prduct.asp?id=3 |
| [34] | David M Jacobson;Andrew Ogilvy;Alan Leatham.Applications of lightweight CE alloys[J].Joint Capital Chapter IMAPS-SMTA,2007(07):4. |
| [35] | Seok,Hyun-Kwang Lee;Jae-Chul Lee et al.Method for fabricating Al-Si alloy packaging material[P].US 285465,2004-07-06. |
| [36] | 杨培勇,郑子樵,蔡杨,李世晨,冯曦.Si-Al电子封装材料粉末冶金制备工艺研究[J].稀有金属,2004(01):160-165. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%