简述了国内外环氧树脂封装料中所用TiO2、MgO、Al(OH)3、CaCO3、BN、BeO等填料的特点,包括填料的形状、颗粒大小、密度以及特殊性能.根据封装材料不同发展阶段的要求,重点叙述了SiO2、Al2O3、AlN等3种粉体作为填料及其所制备的封装材料各自的优势.结合国内外研究现状,指出了环氧树脂电子封装材料用填料应朝着纳米化、功能化、低膨胀系数、绿色化、低成本化的方向发展.
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