Ag/Cu和Cu/Ni纳米金属多层膜强度软化的理论分析

材料热处理学报, 2010, 31(12): 143-147.

Ag/Cu和Cu/Ni纳米金属多层膜强度软化的理论分析

任凤章 ^1, , 陈洁 ^2, , 赵士阳 ^3, , 马战红 ^4, , 王宇飞 ^5, , 田保红 ^6,

1.河南科技大学材料科学与工程学院,河南,洛阳,471003;河南省有色金属材料科学与加工技术重点实验室,河南,洛阳,471003

2.河南科技大学材料科学与工程学院,河南,洛阳,471003

3.河南省有色金属材料科学与加工技术重点实验室,河南,洛阳,471003

4.河南科技大学材料科学与工程学院,河南,洛阳,471003

5.河南科技大学材料科学与工程学院,河南,洛阳,471003

6.河南科技大学材料科学与工程学院,河南,洛阳,471003

基金项目: 河南省基础与前沿技术研究计划资助项目(092300410064) 河南省高校科技创新人才支持计划资助项目(2009 HASTIT023) 国家自然科学基金(50771042) 河南省科技创新人才计划项目(104100510005)

关键词：多层膜 , Hall-Fetch关系 , 临界晶粒尺寸 , 电子理论

Theoretical analysis for the softening of Ag/Cu and Cu/Ni nanometer multilayer films

用电沉积法分别制备了具有不同调制波长的Ag/Cu和Cu/Ni金属多层膜,研究了多层膜的硬度与调制波长之间的关系.结果表明,当调制波长λ>300 nm时,两种多层膜的硬度与调制波长符合位错塞积机制的Hall-Fetch关系,当λ<300 nm时,都偏离了Hall-Fetch关系;Ag/Cu和Cu/Ni多层膜分别在λ=50nm和100nm处取得硬度峰值.基于Cheng等人的电子理论分别求出了Ag,Cu和Ni金属晶体的位错稳定的临界晶粒尺寸,进而定量地解释了Ag/Cu和Cu/Ni金属多层膜硬度峰值位置.

参考文献

[1]	Fu, EG;Li, N;Misra, A;Hoagland, RG;Wang, H;Zhang, X .Mechanical properties of sputtered Cu/V and Al/Nb multilayer films[J].Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing,2008(1/2):283-287.
[2]	A. Misra;J. P. Hirth;R. G. Hoagland .Length-scale-dependent deformation mechanisms in incoherent metallic multilayered composites[J].Acta materialia,2005(18):4817-4824.
[3]	R. G. Hoagland;R. J. Kurtz;C. H. Henager Jr. .Slip resistance of interfaces and the strength of metallic multilayer composites[J].Scripta materialia,2004(6):775-779.
[4]	Wu M S;Wang H Y .Influence of image forces.the size dependence of multilayer shear strength[J].Mechanics of Materials,2008,40(4-5):338-350.
[5]	Nieh T G;Wadsworth J .Hall-Petch relation in nanocrystalline solids[J].Scripts Metallurgica et Materialia,1991,25(04):955-958.
[6]	Gryaznov V G;Kaprelov A M;Romanov A E .Size effect of dislocation stability in small particles and microcrystallites[J].Scripts Metallurgica,1989,23(08):1443-1448.
[7]	NING WANG;ZHIRUI WANG;K. T. AUST;U. ERB .EFFECT OF GRAIN SIZE ON MECHANICAL PROPERTIES OF NANOCRYSTALLINE MATERIALS[J].Acta Metallurgica et Materialia,1995(2):519-528.
[8]	Cheng K J;Cheng S Y .Boundary conditions of electrons at the interface:Part II:Internal stresses in thin films[J].Theoretical and Applied Fracture Mechanics,2001,37(1-3):19-27.
[9]	H. L. Wang;M. J. Chiang;M. H. Hon .Determination of thin film hardness for a film/substrate system[J].Ceramics International,2001(4):385-389.
[10]	余永宁.金属学原理[M].北京:冶金工业出版社,2000
[11]	J. McKeown;A. Misra;H. Kung .Microstructures and strength of nanoscale Cu-Ag multilayers[J].Scripta materialia,2002(8):593-598.
[12]	Verdier M;Fivel M;Gilles B .Some investigations on the effect of layer thickness in multiplayer metal composites on mechanical properties[J].Advances in Engineering Materials,2001,3(08):597-601.
[13]	Amit Misra;Harriet Kung .Deformation behavior of nanostructured metallic multilayers[J].Advanced Engineering Materials,2001(4):217-222.

上一张下一张

计量

下载量()
访问量()

作者相关

文章评分

您的评分：
1

0%
2

0%
3

0%
4

0%
5

0%

材料期刊网