Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films

材料科学技术（英文）, 2010, 26(3): 200-205.

^1, , ^2, , ^3,

1.Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences,Shenyang 110016, China

2.Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences,Shenyang 110016, China

3.Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences,Shenyang 110016, China; Department of Materials Science and Engineering, University of Illinois at Urbana- Champaign, Urbana, IL 61801,USA

基金项目: the National Basic Research Program of China(2004CB619306) the National Natural Science Foundation of China(50501022)

Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films

Wei Liu ^1, , Lei Zhang ^2, , J.K. Shang ^3,

1.Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences,Shenyang 110016, China

2.Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences,Shenyang 110016, China

Keywords： Dewetting

The thermodynamic conditions for dewetting of a liquid solder drop on copper thin films were examined under a hot-stage optical microscope in a flowing protective atmosphere. Dewetting of liquid solder was found to depend strongly on the copper film thickness and preceded by spalling of Cu_6Sn_5 intermetallic compounds.However, the loss of interfacial bonding by spalling was not sufficient to cause immediate dewetting of solder drops if the wetting tip was still strongly bonded to the copper film. By introducing a pinning force on the wetting front, a sufficient condition was found from a force balance analysis for dewetting of the liquid solder drop, in general agreement with the experimental results.

参考文献

[1]	D. W. Zheng;Weijia Wen;K. N. Tu .In situ scanning electron microscopy study of eutectic SnPb and pure Sn wetting on Au/Cu/Cr multilayered thin films[J].Journal of Materials Research,1999(3):745-749.
[2]	E.SAIZ;R.M.CANNON .REACTIVE SPREADING: ADSORPTION, RIDGING AND COMPOUND FORMATION[J].Acta materialia,2000(18/19):4449-4462.

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Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films

参考文献