应用自行研制的亚微米/微米薄膜材料热物理性质多功能测试仪和差示扫描量热仪(DSC)对聚酰亚胺PI及其渗碳改性复合薄膜PI/C的热膨胀系数、热扩散系数和比热进行了实验研究和理论分析,揭示了在20℃至150℃温区内温度对渗碳量30wt%的PI/C复合薄膜的热物性的影响规律和机制.结果显示渗碳量30wt%的复合薄膜比纯PI热膨胀系数减小,导热性能明显提高,且没有改变性能对温度的依赖关系.对PI/C(30wt%)应用加和原理计算的比热值与实测值相吻合,应用Nielson模型和Cheng-Vachon模型的预测值与导热系数实测值基本吻合.
CCD imaging technique,laser flash method and differential scanning calorimeter were utilized to measure the thermal expansion,thermal diffusivity and specific heat of polyimide(PI)films and carbon modified PI composite films(PI/C)at different temperatures. Influences of carbon and temperature on the thermophysical properties of PI/C(30wt%)were analyzed. Results show that the addition of carbon increases the thermal conductivity apparently and decreases thermal expansion between 20℃ and 150℃.The temperature dependences of thermal expansion and thermal conductivity were not changed. The specific heat of PI/C (30wt%)calculated by the addition principle and thermal conductivity of PI/C(30wt%)calculated by the Nielson model and Cheng-Vachon model agree with the measured values.
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