以单晶硅和聚酰亚胺为衬底,用磁控溅射沉积调制周期λ=25～150 nm、调制比η=0.5～2的Cu/W纳米多层膜,用XRD、SEM、EDS、AFM、微力测试系统、纳米压痕仪和四探针法对多层膜微观结构、表面形貌和力学及电学性能进行研究.结果表明:λ和η显著影响多层膜结构和性能.多层膜Cu层和W层均为纳米晶结构,分别呈Cu(111)和W(110)择优取向.W(110)晶面间距减小且减幅与1/λ或η值呈正相关,Cu/W层间界面处存在扩散混合层.表面Cu层晶粒尺寸随Cu层厚增加而增大.裂纹萌生临界应变ε.总体上随λ增大或η减小而下降,屈服强度σ0.2、显微硬度H和电阻率p总体上均与λ或η呈负相关.因Cu层和W层厚度随λ或η的变化而改变,相应地改变了Cu层晶粒度及其晶界密度、W层体积分数和Cu/W层间界面数量,使位错运动能力及电子散射效应变化,最终改变Cu/W纳米多层膜性能.
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