研究了铜基活性钎料钎焊立方氮化硼的焊接性与微观结构,采用真空钎焊方法实现了CuNiSnTi活性钎料与c-BN的可靠连接.多元CuNiSnTi活性钎料对c-BN和基体钢都具有较好的润湿性能,提高钎焊温度可以改善活性钎料对c-BN的润湿性.在500℃时,CuNiSnTi活性钎料钎焊的c-BN超硬耐磨涂层仍具有极好的耐磨性能,与c-BN仍能保持较高的结合强度.采用SEM,XRD对界面观察和分析,并结合键参数理论的计算结果表明,CuNiSnTi活性钎料与c-BN发生冶金作用,形成了化合物型界面.
参考文献
[1] | Jackson M J et al.[J].Journal of Materials Processing Technology,2001,110(01):78. |
[2] | Hintermann H E et al.[J].Diamond and Related Materials,1992,1(12):1131. |
[3] | Ewa Benko;Jan Skrzypek Stanislaw;Bogna Krolicka;A. Wyczesany;Tery L. Barr .cBN-TiN, cBN-TiC composites: chemical equilibria, microstructure and hardness mechanical investigations[J].Diamond and Related Materials,1999(10):1838-1846. |
[4] | Benko E et al.[J].Diamond and Related Materials,1997,6:931. |
[5] | Ding W F et al.[J].Adv Eng Mater A,2006,430(1-2):301. |
[6] | Igor L Pobol;Alexey A Shipko;Irina G .[J].Diamond and Related Materials,1997,6(08):1067. |
[7] | Elsener H R et al.[J].Advances in Engineering Materials,2005,5:375. |
[8] | 任露泉;卢广林;邱小明 et al.[P].CN 200610016981.4,2006. |
[9] | 陈念贻.键参数函数及其应用[M].北京:科学出版社,1976:15. |
[10] | Xiaoyan Ma et al.[J].Materials Science and Engineering A,2005,392(1-2):394. |
[11] | Ding WF;Xu JH;Shen M;Fu YC;Su HH;Xiao B .Solid-state interfacial reactions and compound morphology of cBN grain and surface Ti coating[J].Vacuum: Technology Applications & Ion Physics: The International Journal & Abstracting Service for Vacuum Science & Technology,2006(4):434-440. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%