论述了45～32nm技术节点下高K材料取代SiO2的必要性和基本要求,综述了高K栅介质中极具代表性的Hf基材料.研究表明,向HfO2中分别掺杂Al、si、Ta、N等形成的复合Hf基高K栅介质材料具备较Hfo2更加优异的物理结构、晶化温度、热力学稳定性以及电学特性,但与此同时也存在如何优化掺杂量、沟道载流子迁移率下降以及中间层引起的界面退化等难题.针对这些挑战,探讨了新型"堆垛结构"和引起载流子迁移率下降的物理机制,展望了高K材料在未来先进COMS器件中的应用.
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