通过高能球磨制备铜基纳米氮化铝复合粉体(Cu/AlN),用粉末冶金方法制备Cu/AlN点焊电极并装机进行镀锌薄钢板点焊试验.用XRD、SEM、TEM等表征失效电极的组织形貌,分析电极的失效机制及失效原因.结果表明:铜基纳米复合材料(Cu/AlN)点焊电极的主要失效机制是:"蘑菇化"变形、坑蚀、粘结等,未见电极表面合金化生成新相.Cu/A1N点焊电极使用性能优于铸态商用(CuCrZr)点焊电极,主要因为纳米A1N颗粒的弥散强化作用及其优异的导热性能.
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