EM1滤波连接器是传输信号和抑制导线或电缆电磁干扰的器件.简述了滤波连接器板式阵列芯片的原理和结构设计,比较了干法和湿法工艺在生产板式阵列芯片时各自的优点,着重介绍了干法工艺制备板式阵列芯片的工艺生产过程.通过优化流延工艺、控制丝网印刷精度、提高不同材料的匹配共烧兼容性和增强耐压等处理,成功地研制了不同规格型号的EMI滤波器板式阵列芯片.
参考文献
| [1] | Tiwary A;Anjini K .Performance of microstrip low-pass filter on electromagnetic band gap grond plane[J].Journal of IEEE J Res,2010,56(05):230. |
| [2] | Siah E S;Volakis J L;Pavlilis Ⅰ et al.Electromagnetic analysis of plane wave illumination effects onto passlve and active circuit topologies[J].IEEE Ant Wire Prop Lxtt,2003,2:230. |
| [3] | Brewer R .Systems EMC design and analysis[J].Evalu Eng,200)8,47(11):52. |
| [4] | E. Mercadelli;A. Sanson;P. Pinasco .Tape cast porosity-graded piezoelectric ceramics[J].Journal of the European Ceramic Society,2010(6):1461-1467. |
| [5] | Claire B;Sophie B S;Thierry C .Elaboraion.by tape cas ting,and thermal characterization of a solid oxide fuel half cell for low temperature applicafions[J].Materials Research Bulletin,2010,45(04):49l. |
| [6] | 崔学民,周济,王悦辉,缪春林,沈建红.异质材料共烧匹配性调制在LTCC领域的研究进展[J].电子元件与材料,2005(10):50-55. |
| [7] | Chung L L;Lun L;Jenq G D et al.Low ternperature sintering and crystallization behavior of low loss anorthitcbased glass ceramics[J].Journal of Materials Science,2003,38(04):693. |
| [8] | 唐斌,张树人,袁颖,周晓华.BaTiO3陶瓷中的内应力研究进展[J].材料导报,2008(05):15-18. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%