MEMS微器件电沉积层均匀性的研究进展

稀有金属材料与工程, 2011, 40(12): 2245-2251.

MEMS微器件电沉积层均匀性的研究进展

王星星 ^1, , 雷卫宁 ^2, , 刘维桥 ^3, , 姜博 ^4, , 邹旻 ^5,

1.江苏技术师范学院,江苏常州213001;常州大学,江苏常州213016

2.江苏技术师范学院,江苏常州213001

3.江苏技术师范学院,江苏常州213001

4.江苏技术师范学院,江苏常州213001;常州大学,江苏常州213016

5.常州大学,江苏常州213016

基金项目: 江苏省自然科学基金(BK2006043) 国家自然科学基金(50875116)

关键词：微器件 , 电铸 , 沉积层 , 均匀性 , 超临界CO2

Research Progress on Uniformity of MEMS Micro-Device Electrodeposition

有效地改善沉积层厚度均匀性是电化学沉积技术应用的关键,简述了微电铸原理,综述了国内外微器件沉积层均匀性的最新研究进展,包括优化工艺参数、脉冲电流与换向脉冲电流、改善传质条件、辅助阴极、阴极屏蔽、阳极特性及数值模拟仿真技术改善沉积层均匀性的研究报道,详细介绍了超临界CO2电化学沉积新方法及其优点,并展望了今后的研究重点及发展方向.

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MEMS微器件电沉积层均匀性的研究进展

Research Progress on Uniformity of MEMS Micro-Device Electrodeposition

参考文献