利用Gleeble 3500热模拟实验机,在800～1100 ℃、10～90 min和6～20 MPa条件下对Ti3SiC2和Ni进行真空扩散连接.通过正交实验,研究了连接温度、连接压力和高温保温时间对试样连接强度的影响,优选出最佳工艺参数.结果表明,扩散连接工艺参数显著影响Ti3SiC2/Ni接头的剪切强度.在1000℃、10 min和20 MPa实验条件下,获得的Ti3SiC2/Ni接头的剪切强度达到(121±7)MPa,接近Ti3SiC2陶瓷的剪切强度.
参考文献
| [1] | Barsoum M W .[J].Prog Solid Chem,2000,28:201. |
| [2] | Zhou Y C;Sun Z M .[J].Materials Research Innovations,1999,2:360. |
| [3] | Gao N.F. -;Zhang D;Miyamoto Y .Dense Ti sub 3 SiC sub 2 prepared by reactive HIP[J].Journal of Materials Science,1999(18):4385-4392. |
| [4] | Barsoum MW.;Elraghy T. .SYNTHESIS AND CHARACTERIZATION OF A REMARKABLE CERAMIC - TI3SIC2[J].Journal of the American Ceramic Society,1996(7):1953-1956. |
| [5] | Elraghy T.;Barsoum MW.;Kalidindi SR.;Zavaliangos A. .DAMAGE MECHANISMS AROUND HARDNESS INDENTATIONS IN TI3SIC2[J].Journal of the American Ceramic Society,1997(2):513-516. |
| [6] | Zhou Y C;Sun Z M;Yu B H .[J].Zeitschrift fur Metallkunde,2000,91:937. |
| [7] | El-Raghy T;Barsoum M W;Zavaliangos A et al.[J].Journal of the American Ceramic Society,1999,82:2855. |
| [8] | Sun Z M;Zhou Y C;Li M S .[J].Acta Materials,2001,49:4347. |
| [9] | Gao NF.;Miyamoto Y. .Joining of Ti3SiC(2) with Ti-6Al-4V alloy[J].Journal of Materials Research,2002(1):52-59. |
| [10] | Yin X H;Li M S;Zhou Y C .[J].Journal of Materials Research,2006,9:2415. |
| [11] | Zhou Y C;Sun Z M;Chen S Q et al.[J].Materials Research Innovations,1998,2:142. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%