EFFECT OF LASER INPUT ENERGY ON AuSnx INTERMETALLIC COMPOUNDS FORMATION IN SOLDER JOINTS WITH DIFFERENT THICKNESS OF Au SURFACE FINISH ON PADS

金属学报(英文版), 2008, 21(3): 183-190.

^1, , ^2, , ^3, , ^4,

1.Department of Electronics Packaging Technology, State Key Lab of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China

2.Department of Electronics Packaging Technology, State Key Lab of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China

3.Department of Electronics Packaging Technology, State Key Lab of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China

4.Shenzhen Graduate School of Harbin Institute of Technology, Shenzhen 518055, China

基金项目: 国家自然科学基金(50675047)

EFFECT OF LASER INPUT ENERGY ON AuSnx INTERMETALLIC COMPOUNDS FORMATION IN SOLDER JOINTS WITH DIFFERENT THICKNESS OF Au SURFACE FINISH ON PADS

W.Liu ^1, , C.Q.Wang ^2, , Y.H.Tian ^3, , M.Y.Li ^4,

1.Department of Electronics Packaging Technology, State Key Lab of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China

2.Department of Electronics Packaging Technology, State Key Lab of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China

3.Department of Electronics Packaging Technology, State Key Lab of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China

4.Shenzhen Graduate School of Harbin Institute of Technology, Shenzhen 518055, China

Keywords： Laser soldering

Formation of AuSnx intermetallic compounds (IMCs) in laser reflowed solder joints was investigated. The results showed that few IMCs formed at the solder/0.1 μm Au interface. Needlelike AuSn4 IMCs were observed at the solder/0.5 μm Au interface.In Sn-2.0Ag-0.75Cu-3.0Bi and Sn-3.5Ag-O.75Cu solder joints, when the laser input energy was increased, AuSn4 IMCs changed from a layer to needlelike or dendritic distribution at the solder/0.9 μm Au interface. As for the solder joints with 4.0 μm thickness of Au surface finish on pads, AuSn4 , AuSn2, AuSn IMCs, and Au2 Sn phases formed at the interface. Moreover, the content of AuSnx IMCs, such as, AuSn4 and AuSn2, which contained high Sn concentration, would become larger as the laser input energy increased. In the Sn-37Pb solder joints with 0.9 μm or 4.0 μm thickness of the Au surface finish on pads, AuSn4 IMCs were in netlike distribution. The interspaces between them were filled with Pb-rich phases.

参考文献

[1]	H L Lau.Ball Grid Array Technology[M].McGraw Hill Pub,New York,1995:23.
[2]	J. H. Lee;Y. H. Lee .FLUXLESS LASER REFLOW BUMPING OF Sn-Pb EUTECTIC SOLDER[J].Scripta materialia,2000(8):789-793.
[3]	K. S. Kim;S. H. Huh;K. Suganuma .Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2003(1/2):226-236.
[4]	M O Alam;Y C Chan .[J].Microelectronics Reliability,2002,42:1065.
[5]	D M Jacobson;G Jumpston .[J].Gold Bulletin,1989,22:9.
[6]	Z Mei;M Kaufmann;A Eslambolchi;P Johnson.[A].The Institute of Electrical and Electronics Engineers (IEEE)Press,Seattle,1998
[7]	N. Duan;J. Scheer;J. Bielen;M. van Kleef .The influence of Sn―Cu―Ni(Au) and Sn―Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates[J].Microelectronics and reliability,2003(8):1317-1327.
[8]	P G Kim;K N Tu .[J].Journal of Applied Physics,1996,80:3822.
[9]	P G Kim;K N Tu .[J].Materials Chemistry and Physics,1998,53:165.
[10]	Y Tian;C Wang;X Ge;P Liu and D Liu .[J].Materials Science and Engineering,2002,B95:254.
[11]	K N Tu;K Zeng .[J].Materials Science and Engineering,2001,R34:1.

上一张下一张

计量

下载量()
访问量()

作者相关

在本站搜索
在百度学术搜索
在万方数据库搜索
在CNKI搜索

文章评分

您的评分：
1

0%
2

0%
3

0%
4

0%
5

0%

材料期刊网

EFFECT OF LASER INPUT ENERGY ON AuSnx INTERMETALLIC COMPOUNDS FORMATION IN SOLDER JOINTS WITH DIFFERENT THICKNESS OF Au SURFACE FINISH ON PADS

参考文献