过去有关丁基黄原酸添加剂对铜电沉积行为和电极过程影响的研究还不够.采用线性电位扫描(LSV)、计时电流(CA)、交流阻抗和Tafel极化曲线等电化学方法并结合金相显微镜,研究了添加剂丁基黄原酸的浓度对碱性HEDP(羟基乙叉二膦酸)体系镀铜电沉积过程的影响.结果显示:丁基黄原酸在阴极具有一定的吸附能力,对铜沉积有阻化作用,且丁基黄原酸浓度越大,阻化作用越强;铜电沉积的初期行为服从扩散控制和三维连续成核方式生长规律;丁基黄原酸能提高镀液的微观分散能力,使得镀层光滑而平整.
参考文献
[1] | Ivani. A. Carlos;Moacyr Rodrigo H. de Almeida .Study of the influence of the polyalcohol sorbitol on the electrodeposition of copper–zinc films from a non-cyanide bath[J].Journal of Electroanalytical Chemistry: An International Journal Devoted to All Aspects of Electrode Kinetics, Interfacial Structure, Properties of Electrolytes, Colloid and Biological Electrochemistry,2004(2):153-159. |
[2] | B. Bozzini;L. D'Urzo;C. Mele;V. Romanello .Electrodeposition of Cu from acidic sulphate solutions in the presence of polyethylene glycol and chloride ions[J].Journal of Materials Science. Materials in Electronics,2006(11):915-923. |
[3] | C. A. Huang;T. H. Wang;T. Weirich;V. Neubert .A pretreatment with galvanostatic etching for copper electrodeposition on pure magnesium and magnesium alloys in an alkaline copper-sulfate bath[J].Electrochimica Acta,2008(24):7235-7241. |
[4] | Ballesteros J C;Chainet E;Ozil P et al.Electrodeposition of Copper from Non-Cyanide Alkaline Solution Containing Tartrate[J].International Journal of Electrochemical Science,2011,6(7):2632-2651. |
[5] | Barbosa LL;de Almeida MRH;Carlos RM;Yonashiro M;Oliveira GM;Carlos IA .Study and development of an alkaline bath for copper deposition containing sorbitol as complexing agent and morphological characterization of the copper film[J].Surface & Coatings Technology,2005(2/3):145-153. |
[6] | 方景礼.钢铁件HEDP直接镀铜工艺开发30年回顾第一部分--开发历程与近30年来的改进[J].电镀与涂饰,2009(09):7-9,19. |
[7] | Martin S .Halogen additives for alkaline copper use for plating zinc die castings[P].US,6054037,2000-04-25. |
[8] | 庄瑞舫.应用CuR-1型添加剂的HEDP镀铜新工艺[C].2004年北京推动电镀与精饰清洁生产技术论坛论文集,2004:90-93. |
[9] | 蔡积庆.电镀铜中添加剂的吸附机理解析[J].印制电路信息,2011(05):31-34,57. |
[10] | 肖发新,曹岛,毛建伟,申晓妮,杨涤心.印制线路板酸性镀铜组合添加剂的工艺性能[J].材料保护,2011(07):30-34. |
[11] | 辜敏,钟琴.3-巯基-1-丙烷磺酸钠复配添加剂对铜电沉积的作用及机理[J].材料保护,2011(04):11-14. |
[12] | 夏熙,刘洪涛,刘洋.Ce4+/Ce3+氧化还原体系线性极化与交流阻抗研究[J].化学学报,2002(09):1630-1636. |
[13] | 曹楚南;张鉴清.电化学阻抗谱导论[M].北京:科学出版社,2002:26-36. |
[14] | Scharifker B;Hills G .Theoretical and experinental studies of multiple nucleation[J].Electrochimica Acta,1983,28(7):879-889. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%