本研究通过在电晕放电处理的ABS树脂表面自组装6-（3-三乙氧基硅基丙基氨）-1,3,5-三嗪-2,4-二硫醇单钠盐（TES）薄膜后,进行化学镀铜研究。借助X-射线光电子能谱（XPS）、傅里叶变换红外光谱（FT-IR）、扫描电子显微镜（SEM）对ABS树脂、自组装薄膜及化学镀铜表面进行了表征,同时对化学镀铜做了粘接性能测试。结果表明：经TES自组装薄膜修饰后的ABS树脂表面呈现大量孔状结构,使ABS树脂表面的粗糙度增大,提高了ABS树脂与铜的结合力;化学镀铜后表面铜颗粒致密且均匀;盐水浸泡实验表明,经TES自组装薄膜修饰后的ABS树脂与铜层之间表现出良好的粘接特性。
6-(3-(triethoxysilyl)propylamino)-1,3,5-triazine-2,4-dithiol monosodium(TES) was used to fabricate self-assembled film on corona pretreated ABS surface.Then the TES film modified ABS was treated by electroless copper plating.XPS and FT-IR were used to investigate the chemical structure of corona pretreated ABS surface and TES film.The morphologies of the ABS surface after modification of TES film and electroless copperplating were studied by SEM.And the adhesion property of electroless copperplating on ABS surface was tested.The results indicate that porous morphology appears on the ABS surface modified by TES film,and the surface roughness increases.The adhesion property between the ABS surface with the self-assembled film and the electroless copper plating is greatly improved.The electroless copper plating on ABS surface is dense and uniform.
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