用固-固热压扩散焊接复合法制备Ti/A1复合电极,通过SEM、EDS、四探针法及电化学测试等技术对样品的结构与性能进行表征,与传统Ti电极对比研究了Ti/Al复合电极的性能.结果表明:焊接温度为540℃、保温时间为90 min制备的Ti/A1复合界面为结构稳定、导电性能优异的TiAl3单一物相层.此时复合电极的界面电阻最低,电化学性能最佳.通过第一性原理计算出4种Ti/Al金属间化合物的生成焓大小的排序为Ti3Al＜TiAl＜TiA12＜ TiAl3,结合能的排序为Ti3Al＜ TiAl＜TiAl2＜ TiA13.从热力学角度解释了单一界面层扩散层TiAl3的生成机理,从扩散动力学计算出Ti/A1界面扩散层的生长动力学方程.
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