采用熔铸法制备了Cu-71.8%Ag(质量分数)合金, 研究了共晶体中两相的位向关系和界面结构. 约50%的相界面两侧Cu和Ag两相位向对称于(111)晶面. 出现对称位向的相界面形态为台阶状, 台阶平面与(111)平行, 高度为(111)Cu和(111)Ag晶面间距的平均值, 宽度为3—4个(11-1)Cu晶面间距. 在此界面上, 每隔3—4个(11-1)Cu晶面间距出现一个点阵重合位置.
A eutectic Cu-71.8 wt.% Ag alloy was prepared by conventional process of fusion casting. There are approximate fifty percent of stepped phase interfaces with the step plane surface parallel to (111) and an orientation relationship between phases Cu and Ag symmetrized to the stepped interface in the eutectic structure. The stepped interfaces have a height equal to the average interplanar distance of Cu(111) and Ag(111) and the widths equal to the interplanar distances of 3-4 Cu(11-1). A coincident lattice site of Cu and Ag atoms can exist at the stepped interfaces at regular intervals of 3-4 Cu(11-1).
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