研究了电脉冲处理对热镀锌镀层组织和生长影响。采用冷轧钢板在460℃条件下得到不同电脉冲处理参数不同浸镀时间的镀层组织,结果表明,未经电脉冲处理试样铁锌互扩散较快,δ相和ζ相同时生长,且随时间延长ζ相呈起伏式生长,合金层的组织变得不连续且存在疏松。电脉冲处理后试样合金层的生长均受到抑制,生长比较稳定。在180 s浸镀时间内,δ相层的组织晶粒度均匀致密,ζ相的连绵式生长消失,与δ相和η相相界面变得非常连续,厚度明显减薄,由83.5μm减薄到70μm以内。经电脉冲处理后,合金层的生长由扩散和界面反应联合控制转变为仅受扩散控制。
Growth of ho-dip galvanizing coatings on cold-rolled steel speet fabricated by hot-dipping in zinc melt after electric pulse treatment was investigated.The microstructure of the galvanizing coatings obtained by the hot-dipping in zinc melt at 460 ℃ for different time was examined.The results show that the quick mutual diffusion between iron and zinc occurs far galvanizing without the treatment of electric pulse modification.The ζ layer and η layer was grown at the same time and the ζ layer is thicker where η layer is thinner due to the fluctuated growth of the ζ layer,and microstructure of the alloy layer is uneven and porous.With the electric pulse modification of zinc melt the growth of alloy layers is restrained within 180 seconds.The grain size of δ layer becomes uniform and dense and the interface between ζ layer and η layer becomes even because of the disappearing of fluctuated growth of ζ layer.The alloy layer thickness is obviously reduced from 83.5 μm to 70 μm,and the growth mechanism of alloy layer changes from the mechanism of interface reaction and diffusion to the diffusion mechanism for the galvanizing without and with electric pulse treatment.
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