运用金相组织分析、差热分析(DSC)、X射线衍射(XRD)、扫描电镜(SEM)和能谱(EDS)对铸态、固溶态(750℃、1 h，850℃、4 h，950℃、1 h)和热处枞950℃、4 h后的金基合金的显微组织进行了研究。该金基合金由Au(Cu，Pd)固溶体和Pt(Rh，Ni)固溶体以及它们的混合物构成。随着热处枞温度的提高，Pd 溶质由混合物中偏析出来。在700℃、850℃和950℃进行热处枞时，形成了L12结构的AuCu3相。
The microstructures of Au-based alloy were investigated for the as-casted state, solution heat treated at 750℃ for 1 h, 850℃ for 4 h, and 950℃ for 1 h, and uniform heat treated at 950℃for 4 h by metallurgical structure examination, differential thermal analysis (DSC), X-ray diffraction (XRD), scanning electron micrograph (SEM) and energy spectrum analysis (EDS). This Au-based alloy is composed of Au(Cu, Pd), Pt(Rh, Ni), and the mixture of both. With the heat treated temperature elevated, Pd solute segregated from the mixtures. AuCu3 phase with L12 structure formed as heat treated at 700℃, 850℃, and 950℃.
参考文献
| [1] | 赵怀志;宁远涛.金[M].长沙:中南大学出版社,2003 |
| [2] | Strang R;Whitters C J;Brown D et al.Dental materials:1996 literature review[J].Journal of Dentistey,1998,26:191-207. |
| [3] | Strang R;Whitters C J;Brown D et al.Dental materials:1996 literature review:Part 2[J].Journal of Dentistey,1998,26:273-291. |
| [4] | Whitters C J;Strang R;Brown D et al.Dental materials:1997 literature review[J].Journal of Dentistey,1999,27:401-435. |
| [5] | Chaston J C .Industrial Uses of Au[J].Int Met Rev,1977,22:25-38. |
| [6] | Paul Goodman .Current and Future Uses of Gold in Electronics[J].Gold Bulletin,2002(1):21-26. |
| [7] | 谢佑卿.Au-Ni合金中组元的平均原子体积和偏摩尔体积的关系[J].中国有色金属学报（英文版）,2011(08):1801-1807. |
| [8] | 徐晓宁,任玉平,李长发,李松,秦高梧.Au-Pt二元合金的热力学评估[J].中国有色金属学报（英文版）,2012(06):1432-1436. |
| [9] | Xie Y Q;Li Y F;Liu X B et al.Characteristic atom occupation patterns of Au3Cu,AuCu3,AuCuI and AuCuII based on experimental data of disordered alloys[J].Transactions of Nonferrous Metals Society of China,2011,21(05):1092-1104. |
| [10] | Xie Y Q;Liu X B;Li X B et al.Potential energies of characteristic atoms on basis of experimental heats of formation of AuCu and AuCu3compounds(I)[J].Transactions of Nonferrous Metals Society of China,2009,19(05):1243-1256. |
| [11] | Ning Y .Influence of gd addition on the structure and properties of Au-Ni and Au-Ni-Cr alloys[J].Gold Bulletin,2006,39(04):220-225. |
| [12] | 宁远涛.Au与Au合金材料近年的发展与进步[J].贵金属,2007(02):57-64. |
| [13] | 宁远涛.Au与Au合金的微合金化[J].贵金属,2008(02):55-61. |
| [14] | 张康侯.含金三元合金系的研究进展（1996～2007年）[J].贵金属,2008(02):47-54,61. |
| [15] | Antler M .The application of palladium in electronic connectors[J].Platinum Metals Review,1982,26(03):106-117. |
| [16] | 谷云彦;李宝绵;代恩泰 .饰品用金合金及其新进展[J].云南冶金,1997,26(03):53-57. |
| [17] | Antler M .Electrical effects of fretting connector contact materials:a review[J].WEAR,1985,106(01):5-33. |
| [18] | Antler M .Gold in electrical contacts[J].Gold Bulletin,1971,4(03):42-46. |
| [19] | 冯景苏.牙科贵金属铸造合金[J].稀有金属,2000(06):450-453,469. |
| [20] | Li Y;Wang Y;Wu B .[J].Non-Ferous Mining and Metallurgy,1999,53 |
| [21] | Kim HI;Kim YK;Jang MI;Hisatsune K;Sakrana AA .Age-hardening reactions in a type III dental gold alloy.[J].Biomaterials,2001(11):1433-1438. |
| [22] | Winn H.;Tanaka Y. .Two types of checkerboard-like microstructures in Au-Cu-Pd ternary alloys[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2000(1/2):262-269. |
| [23] | Hyung-Il Kim;Doung-Hun Lee;Jae-Seong Sim .Age-hardening by miscibility limit of Au-Pt and Ag-Cu systems in an Au-Ag-Cu-Pt alloy[J].Materials Characterization,2009(5):357-362. |
| [24] | Krumbein S J;Antler M .Corrosion inhibition and wear protection of gold plated connector contacts[J].Parts Materials and Packaging IEEE Transactions on,1968,4(01):3-11. |
| [25] | Antler M .Gold connector contacts:developments in the search for alternate materials[J].Parts Hybrids and Packaging IEEE Transactions on,1975,11(03):216-220. |
| [26] | Lafontan X;Pressecq F;Perez G.Physical and reliability issues in MEMS microrelays with gold contacts[A].,2001:11-21. |
| [27] | Zhenyin Yang;Daniel J. Lichtenwalner;Arthur S. Morris, III;Jacqueline Krim;Angus I. Kingon .Comparison of Au and Au-Ni Alloys as Contact Materials for MEMS Switches[J].Journal of Microelectromechanical Systems: A Joint IEEE and ASME Publication on Microstructures, Microactuators, Microsensors, and Microsystems,2009(2):287-295. |
| [28] | 曾婵,刘丽,孙平,王小祥.贵金属齿科铸造合金时效后结构和性能研究[J].稀有金属材料与工程,2005(11):1786-1789. |
| [29] | Park J H;Cho M H;Park M G et al.[J].Gold Bulletin,2010,43:316-323. |
| [30] | 武海军,张国庆,宋泓清,万吉高,张瑞华,黄炳醒.Pd-Ag-Sn-In-Zn合金时效强化机制研究[J].稀有金属材料与工程,2007(08):1487-1489. |
| [31] | Ning Y;Peng Y;Dai H .A new electrical contact alloy with high reliability based on gold[J].Gold Bulletin,2002,35(03):75-81. |
| [32] | Dai Y.Binary Alloy Phase Diagrams[M].北京:科学出版社,2009 |
| [33] | 长崎诚三;平林真;刘安生.二元合金状态图集[M].北京:冶金工业出版社,2004 |
| [34] | 郭青蔚;王桂生;郭庚辰.常用有色金属二元合金相图集[M].北京:化学工业出版社,2010 |
| [35] | 周玉;武高辉.材料分析测试技术[M].哈尔滨:哈尔滨工业大学出版社,1998 |
| [36] | 谢佑卿 .Au-Cu系中无序和有序相的晶格常数[J].金属学报,1998,34(12):1233-1242. |
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