Cu-Cr合金是一种很好的时效强化型合金,其性能主要取决于Cr在Cu基中的分布.对Cu-0.2Cr合金研究发现,当Cr固溶于铜中时硬度和导电性最低,通过时效后的衍射和性能分析,析出相为fcc(face-centered cubic) 的Cr且与基体保持着共格关系,其硬度和导电性分别提高了32.8Hv和39.9IACS%.对时效后合金的强度按共格弥散强化造成的切变应力的增量进行估算,其估算值与实测值相差6%.用马提申定则对固溶和时效后合金的导电性进行估算,估算结果与实测结果相差较小,因此在低固溶条件下,可以利用马提申定则对固溶和时效后Cu-Cr合金的导电性进行估算.
参考文献
[1] | Rys J;Rdzawski Z .[J].Metals and Technology,1980,7:32-35. |
[2] | West E G.Copper and its alloys[M].Chichester:Ellis Ellis Horwood Limited,1982:1-126. |
[3] | Batra IS.;Kulkarni UD.;Banerjee S.;Dey GK. .Microstructure and properties of a Cu-Cr-Zr alloy[J].Journal of Nuclear Materials: Materials Aspects of Fission and Fusion,2001(2):91-100. |
[4] | 周武平.铜铬系真空触头材料制造工艺[J].高压电器,1993(05):7. |
[5] | Jin Y.;Takeuchi T.;Suzuki HG.;Adachi K. .Ageing characteristics of Cu Cr in-situ composite[J].Journal of Materials Science,1998(5):1333-1341. |
[6] | C.P.Luo;U.Dahmen .Interface structure of faceted lath-shaped Cr precipitates in a Cu-0.33 WT/100 Cr alloy[J].Acta materialia,1998(6):2063-2081. |
[7] | Ardell A J .[J].Metallurgical and Materials Transactions,1985,16:2131-2165. |
[8] | Eshelby J D .[J].Proceedings of the Royal Society of London,1957,241:376-396. |
[9] | Hansen N .[J].Metallurgical and Materials Transactions,1985,16:2167-2190. |
[10] | Lee Jongsang;Jung J Y;Lee E S et al.[J].Materials Science and Engineering,2000,277(1-2):274-283. |
[11] | 田荣璋;王祝堂.铜合金及其加工手册[M].长沙:中南大学出版社,2000:135-141. |
[12] | Szablewski J;Kuzhick B .[J].Materials Science and Engineering,1991,7(05):407-409. |
[13] | 陈述川.材料物理性能[M].上海:上海交通大学出版社,1999:40. |
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