MICROBRIDGE TESTING OF YOUNG'S MODULUS AND RESIDUAL STRESS OF NICKEL FILM ELECTROPLATED ON SILICON WAFER

金属学报(英文版), 2004, 17(3): 247-254.

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1.Key Laboratory for Thin Film and Microfabrication of Ministry of Education, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiaotong University, Shanghai 200030, China

2.Key Laboratory for Thin Film and Microfabrication of Ministry of Education, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiaotong University, Shanghai 200030, China

3.Key Laboratory for Thin Film and Microfabrication of Ministry of Education, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiaotong University, Shanghai 200030, China

4.Key Laboratory for Thin Film and Microfabrication of Ministry of Education, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiaotong University, Shanghai 200030, China

5.Key Laboratory for Thin Film and Microfabrication of Ministry of Education, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiaotong University, Shanghai 200030, China

6.Key Laboratory for Thin Film and Microfabrication of Ministry of Education, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiaotong University, Shanghai 200030, China

7.Key Laboratory for Thin Film and Microfabrication of Ministry of Education, Research Institute of Micro/Nanometer Science and Technology, Shanghai Jiaotong University, Shanghai 200030, China

8.State Key Laboratory of Nonlinear Mechanics (LNM), Institute of Mechanics, The Chinese Academy of ciences, Beijing 100080, China

基金项目: 国家重点基础研究发展计划(973计划)(G1999033103) the State Key Laboratory of Nonlinear Mechanics (LNM), Institute of Mechanics, Chinese Academy of Sciences

MICROBRIDGE TESTING OF YOUNG'S MODULUS AND RESIDUAL STRESS OF NICKEL FILM ELECTROPLATED ON SILICON WAFER

Keywords： nickel film microbridge

Microbridge testing is used to measure the Young's modulus and residual stresses of metallic films. Nickel film microbridges with widths of several hundred microns are fabricated by Microelectromechanical Systems. In order to measure the mechanical properties of nickel film microbridges, special shaft structure is designed to solve the problem of getting the load-deflection curves of metal film microbridge by Nanoindenter XP system with normal Berkovich probe. Theoretical analysis of the microbridge load-deflection curve is proposed to evaluate the Young's modulus and residual stress of the films simultaneously. The calculated results based on the experimental measurements show that the average Young's modulus and residual stress are around 190GPa and 175MPa respectively, while the Young's modulus measured by Nanohardness method on nickel film with silicon substrate is 186.8±7.34GPa.

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MICROBRIDGE TESTING OF YOUNG'S MODULUS AND RESIDUAL STRESS OF NICKEL FILM ELECTROPLATED ON SILICON WAFER

参考文献