超声喷雾热解法(USP)作为一种新兴的薄膜制备技术,已制备出多种半导体薄膜材料,并成功应用于太阳能电池、传感器、固态氧化物燃料电池等领域.介绍了USP制备薄膜技术的原理,结合近年来USP技术在半导体薄膜制备领域的研究进展,系统阐述了超声喷雾热解法制备薄膜的原理、工艺过程及在此过程中发生的物理化学变化,详细分析了前驱体溶液化学组成、沉积温度、退火处理等各个工艺参数对薄膜沉积过程和成膜质量的影响,指出了该技术目前存在的问题及今后的发展方向.
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