利用透射电镜和显微硬度法对Cu-Ni-Si组合时效工艺进行研究,研究表明,预时效工艺对Cu-Ni-Si合金的二次时效强化效应产生显著的影响,450℃×8h预时效工艺二次时效强化效应最为明显,强化效应产生的温度范围在300～350℃,显微硬度升高20～60HV;500℃×8h、450℃×4h预时效工艺也有一定的二次时效强化效应,在350℃二次时效,显微硬度升高10HV左右;550℃×8h预时效处理后,在任何温度下二次时效均未发现明显的时效强化效应.经分析认为Cu-Ni-Si合金二次时效强化效应产生的原因是:合金经强烈的塑性变形后形成了高密度位错,当加热到较低温度时,基体残留的溶质原子与位错发生弹性交互作用,在位错处形成科垂尔气团,从而阻止位错运动,产生强化效应.组合时效可在较短的时效时间内获得更高的导电率,经预时效后冷变形的合金,溶质原子可借助密集且分布均匀的位错网络由铜基体快速传输至析出物处或析出物的形核部位完成析出过程,使铜基体得到快速的净化,从而获得较高的导电性.
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