According to probability theory and atomic activation on bonding interface of metals, a mathematical model was developed for the atomic interfacial reaction during diffusion bonding.The effect of parameters of bonding processing and material on the bonding strength was then gained.It was suggested that the activation centre of atomic interfacial reaction of bonding may be,in situ,the boundary dislocation and its elastic stress field. A substantial agreement about the quantitative prediction of the model was made with the results of diffusion bonding experiments for 7075Al alloy
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