为提高镀层沉积速度和沉积质量，采用新型的柔性摩擦辅助电沉积技术在不同的电流密度下制备了镍镀层。利用SEM、XRD、X射线应力衍射仪以及硬度计等手段对镍镀层的组织结构和性能进行了表征。结果表明：电流密度对柔性摩擦辅助电沉积镍镀层的质量具有重要影响。在1~13 A/dm2的电流密度范围内，随着电流密度的增大，柔性介质的摩擦整平作用逐渐减弱，镀层的择优取向发生了(111)晶面向(200)晶面的过渡转变；当电流密度达到13 A/dm2时，镍镀层出现了(200)和(220)晶面的双择优取向，但择优取向程度不大；电流密度为10 A/dm2时，柔性摩擦辅助电沉积镍镀层具有最低的拉应力，为150 MPa左右，最小的表面粗糙度为Ra=0.48μm，最小的孔隙率为0.08 cm-2，最高的硬度为385 HV。
In order to improve the speed and quality of deposition, Ni coatings were prepared by a novel flexible medium friction assisted electrodeposition technology at different current densities. The microstructures and properties of the Ni electroplating were characterized by SEM, XRD, X-ray stress diffraction and micro hardness tester, respectively. The results show that the current density has important effect on the quality of electrodeposited Ni coatings by flexible medium friction. At the current density of 1-13 A/dm2, with increasing current density, the leveling power gradually becomes weaken by flexible medium friction, and the preferred orientation of Ni coatings transits from (111) crystal face to (200) crystal face. When the current density reaches 13 A/dm2, the electrodeposited Ni shows dual preferred orientation of (200) and (220) crystal face, but the degree is not too high. At the current density of 10 A/dm2, flexible medium friction assisted Ni electroplating has the lowest residual stress about 150 MPa, lowest surface roughness Ra of 0.48 μm, lowest porosity of 0.08 cm-2 and highest microhardness of 385 HV.
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