等温时效过程中,复合钎料内部颗粒周围金属间化合物层的变化会影响其钎焊接头的力学性能.本研究选用比较有前途的Sn-3.5Ag共晶钎料作为基体,微米级Cu或Ni颗粒作为增强相外加到基体中制成复合钎料.对复合钎料钎焊接头在不同温度(125, 150, 175 ℃)下进行时效,研究了等温时效过程中增强颗粒周围金属间化合物的层厚增长系数和生长激活能,以及层厚增长对复合钎料钎焊接头力学性能的影响.结果表明,等温时效下,复合钎料内部Cu颗粒周围金属间化合物层增长速率明显大于Ni颗粒周围金属间化合物层的增长速率,且其层生长激活能低于Ni颗粒周围金属间化合物层.时效过程中,Cu颗粒增强复合钎料钎焊接头的剪切强度下降更快.此外,本研究还利用有限元模拟分析了时效过程中增强颗粒周围的应力分布情况.研究表明,经过时效后,随着颗粒周围金属间化合物的增长,颗粒周围的金属间化合物在受力的情况下会造成一定的应力集中而更易发生开裂.
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