以F127和CTMABr为模板剂,采用一步法经水热合成了巯基(-SH)修饰的新型介孔吸附剂,并将其应用于水溶液中Ag+的去除研究.分别考察了初始pH值、振荡时间、Ag+初始浓度和金属离子竞争对介孔吸附剂性能的影响.结果表明,在pH 5～6的范围内该吸附剂Ag+吸附量最大(Q=2.998mmool/g),其吸附机理是巯基(-SH)与Ag+的离子交换和配位化学吸附反应.在Cu2+、Ni2+、Co2+和pb2+等竞争性金属阳离子存在的情况下,Ag+去除率仍然高达90%以上.该介孔吸附剂对Ag+具有较高的吸附效率,其吸附符合Langmuir模型.
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