电子产品多用焊膏焊接,其黏度稳定性常受某些酸性物质的腐蚀而下降,进而导致可焊性下降.研究了SnAgCu无铅焊锡微粉在0.1 mol/L 乙二酸水溶液和0.1 mol/L 乙二酸乙醇溶液中的常温腐蚀行为,以及添加16 mmol/L 缓蚀剂苯并三唑(BTA)对其腐蚀行为的影响,并对微粉的腐蚀与缓蚀机制进行了分析.结果表明:焊锡微粉在乙二酸水溶液中的腐蚀程度比在同浓度的乙二酸乙醇溶液中更为严重,且在乙二酸水溶液中微粉表面出现大量均匀分布的腐蚀沟槽,而在乙二酸乙醇溶液中只有少量点蚀痕迹;微粉表面的富锡相易被腐蚀;焊膏中加入BTA对焊锡微粉有良好的缓蚀保护作用,由此使焊膏黏度的稳定性得到保证.
The corrosion behavior of lead-free SnAgCu solder powders in aqueous and ethanol solutions of 0. 1 mol/L oxalic acid was evaluated. The effect of organic inhibitor 1,2,3-benzotriazole(BTA, 16 mmol/L) on the corrosion resistance of the solder powders was studied by conducting immersion corrosion test at room temperature. Moreover, the micro-morphology of the powders was observed by using a scanning electron microscope(SEM), and the corrosion and inhibition mechanisms of the powders were analyzed. Results indicate that the solder powders have experienced more severe corrosion in the aqueous solution of oxalic acid than in the ethanol solution of oxalic acid at the same concentration. A large number of corroded grooves were formed on the surface of the solder powders in the aqueous solution of oxalic acid, while only a few pitted spots were formed thereon in the ethanol solution of oxalic acid. At the same time, the tin-rich phase on the surface of the solder powders was more liable to corrosion. And BTA was able to effectively prevent the solder powders from corrosion in both aqueous and ethanol solutions of oxalic acid, contributing to the maintenance of good viscosity stability of the lead-free solder powders.
参考文献
| [1] | タムラ化研株式会社 .ソルダペヘスト组成物[P].JP,2007136491 A,2007-06-07. |
| [2] | 张文典.实用表面组装技术[M].北京:电子工业出版社,2006:165-172. |
| [3] | El-Sherbini E E F .Cyclic vohammetry investigation of dissolution of tin in isobutyric acid solution and inhibition effect of some polymers[J].Journal of Electroanalytical Chemistry,2005,584(02):167-173. |
| [4] | Rehim SSA.;Sayyah SM.;El Deeb MM. .Corrosion of tin in citric acid solution and the effect of some inorganic anions[J].Materials Chemistry and Physics,2003(3):696-703. |
| [5] | Fawzy M A;Sedahmed G H;Mohamed A A .Corrosion behaviour of Pb-Sn binary alloys in acid solutions[J].Surface Technology,1981,14(03):257-264. |
| [6] | 赵麦群,赵高扬,于喜良,袁晓宇.无铅焊锡合金粉末超音速雾化技术的研究[J].粉末冶金技术,2003(02):96-98. |
| [7] | Rosalbino F;Angelini E;Zanicchi G et al.Corrosion behaviour assessment of lead-free Sn-Ag-M(M=In,Bi,Cu)solder alloys[J].Materials Chemistry and Physics,2008,109(2,3):386-391. |
| [8] | 黄建中;左禹.材料的耐蚀性和腐蚀数据[M].北京:化学工业出版社,2003:317. |
| [9] | 吴荫顺;郑家燊.电化学保护和缓蚀剂应用技术[M].北京:化学工业出版社,2006:48,614-615. |
| [10] | 张万友,王冰,廖强强,周国定.BTA系列CU缓蚀剂的电化学行为[J].腐蚀科学与防护技术,2001(05):263-266. |
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