在印制电路板化学镀镍/金过程中，镍、金原子固有的结构特征使镍镀层极易被氧化腐蚀，从而影响镀层的可焊性。从化学镀Ni-P基多元合金，引入纳米粒子和稀土材料，以及化学镀Ni-B合金三方面，介绍了改善印制电路板化学镀镍层耐蚀性的研究现状。对印制电路板化学镀镍耐蚀性的改善方法提出了建议。
Oxidation corrosion of nickel coating occurs easily during the electroless nickel/gold plating process on the surface of printed circuit board because of the inherent structure features of nickel and gold atoms, thus affecting the solderability of coating. The research progress of improvement of corrosion resistance of electroless nickel coating on printed circuit board was introduced from three aspects including electroless Ni-P-based multicomponent alloy plating, introduction of nanoparticles and rare earth materials, and electroless Ni-B alloy. Some suggestions about improvement method of corrosion resistance of electroless nickel coating on printed circuit board were proposed.
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