采用等离子增强化学气相沉积(PECVD)系统,以乙硅烷和氢气为气源,石英玻璃和单晶硅片为衬底制备了氢化非晶硅(a-Si∶ H)薄膜.采用扫描电子显微镜、X-射线衍射仪、台阶仪、紫外可见分光光度计、傅里叶变换红外光谱仪和电子能谱仪等分别表征了a-Si∶H薄膜的表面形貌、结晶特性、沉积速率,光学带隙,键合结构和Si化合态等特性.结果表明:随着衬底温度的增加,a-Si∶H薄膜表面的颗粒尺寸减小,均匀性增加,沉积速率则逐渐降低;衬底温度从80℃增加到130℃时,光学带隙显著增加,而在130℃至230℃范围内,光学带隙基本不随衬底温度变化;以SiH键对应的伸缩振动的相对峰强度逐渐增加,而以SiH2或(SiH2)n键对应的伸缩振动的相对强度逐渐减小;a-Si∶H薄膜中Si0+态的相对含量增加.因此,衬底温度大于130℃有利于制备优质a-Si∶H薄膜,230℃是沉积a-Si∶H薄膜的最佳衬底温度.
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