为了在聚酰亚胺（PI）表面得到结合力良好的化学镀层，采用KOH溶液进行化学改性，在其表面制备金属钯微粒，然后进行化学镀铜。采用红外光谱仪（FTIR—ATR），显微电子探针（EDS）表征聚酰亚胺表面结构及表面元素，用x射线衍射（XRD），扫描电子显微镜（SEM）表征铜镀层性能。结果表明：聚酰亚胺表面在KOH溶液中发生水解，在氯化钯溶液中实现K＋和Pd2＋间的离子交换，形成吸附Pd2＋；Pd2＋被二甲氨基甲硼烷还原成钯原子，形成金属钯微粒；该钯微粒不仅能引发化学镀铜反应的发生，还能获得结合力良好的化学镀层。
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