高强度、高导电性Cu-Nb微观复合材料的研究进展

材料导报, 2013, 27(11): 50-69.

高强度、高导电性Cu-Nb微观复合材料的研究进展

马小波 ^1, , 梁明 ^2, , 卢亚锋 ^3, , 李成山 ^4, , 徐晓燕 ^5, , 王鹏飞 ^6,

1.西北有色金属研究院,西安710016

2.西北有色金属研究院,西安710016

3.西北有色金属研究院,西安710016

4.西北有色金属研究院,西安710016

5.西北有色金属研究院,西安710016

6.西北有色金属研究院,西安710016

基金项目: 国家高新技术发展"863"计划(2007AA03Z513) 国家自然科学基金(51031002)

关键词： Cu-Nb微观复合材料 , 集束拉拔 , 磁控溅射 , 高强度 , 高导电

Research Progress on Cu-Nb Micro-composites with High Strength and Conductivity

主要介绍了采用集束拉拔和磁控溅射方法制备高强度、高导电性Cu-Nb微观复合材料的研究情况,从微观结构、强化机制、力学性能以及电导特性等方面综述了高强高导Cu-Nb复合材料的研究现状,并指出了其进一步的研究方向及发展前景.

参考文献

[1]	尹志民,张生龙.高强高导铜合金研究热点及发展趋势[J].矿冶工程,2002(02):1-5,9.
[2]	黄崇祺.轮轨高速电气化铁路接触网用接触线的研究[J].中国铁道科学,2001(01):1-5.
[3]	马莒生,黄福祥,黄乐,耿志挺,宁洪龙,韩振宇.铜基引线框架材料的研究与发展[J].功能材料,2002(01):1-4.
[4]	向文永,陈小祝,匡同春,成晓玲,钟秋生,刘国洪.集成电路用引线框架材料的研究现状与趋势[J].材料导报,2006(03):122-125.
[5]	帅歌旺,张萌.高强度、高导电铜合金及铜基复合材料研究进展[J].特种铸造及有色合金,2005(09):534-537.
[6]	Thilly L.;Coffe G.;Peyrade JP.;Askenazy S.;Lecouturier F. .Ultra high strength nanofilamentary conductors: the way to reach extreme properties[J].Physica, B. Condensed Matter,2001(0):648-652.
[7]	Singleton J;Mielke CH;Migliori A;Boebinger GS;Lacerda AH .The national high magnetic field laboratory pulsed-field facility at Los Alamos National Laboratory[J].Physica, B. Condensed Matter,2004(0):614-617.
[8]	Lecouturiera F et al.Perspectives for Cu/SS macrocomposite and Cu/X nanofilamentary conductors used in non-destructive high-field pulsed magnets under cryogenic conditions[J].Physica B,2004,346-347:582.
[9]	Vidal V et al.Effects of size and geometry on the plasticity of high-strength copper/tantalum nanofilamentary conductors obtained by severe plastic deformation[J].Acta Materialia,2006,54:1063.
[10]	V. Vidal;L. Thilly;F. Lecouturier;P.-O. Renault .Cu nanowhiskers embedded in Nb nanotubes inside a multiscale Cu matrix: The way to reach extreme mechanical properties in high strength conductors[J].Scripta materialia,2007(3):245-248.
[11]	Shikov A.;Vorobieva A.;Khlebova N.;Silaev A.;Pantsyrnyi V. .High strength, high conductivity Cu-Nb based conductors with nanoscaled microstructure[J].Physica, C. Superconductivity and its applications,2001(1/4):410-414.
[12]	Botcharova E;Freudenberger J;Schultz L .Mechanical and electrical properties of mechanically alloyed nanocrystalline Cu-Nb alloys[J].Acta materialia,2006(12):3333-3341.
[13]	Demkowicz MJ;Hoagland RG .Structure of Kurdjumov-Sachs interfaces in simulations of a copper-niobium bilayer[J].Journal of Nuclear Materials: Materials Aspects of Fission and Fusion,2008(1):45-52.
[14]	陈剑辉,刘保亭,李晓红,王宽冒,李曼,赵冬月,杨林,赵庆勋.非晶Ni-Al-N薄膜用作Cu互连阻挡层的研究[J].真空科学与技术学报,2011(01):23-26.
[15]	Jones H;Schneider-Muntau H J et al.Pulsed single and multisection magnets using various wires,includig CuNb microcomposites[J].IEEE Transactions on Magnetics,1994,30(04):245.
[16]	Portugall O.;Marquez J.;Givord D.;Askenazy S.;Lecouturier F. .Pulsed magnetic fields in Toulouse - past, present and future[J].Physica, B. Condensed Matter,2001(0):579-584.
[17]	Hering haus F;Raabe D;Kaul L .Manufacturing of a copper-niobium-composite by melting technologies[J].Metall,1993,47(06):558.
[18]	E. Botcharova;M. Heilmaier;J. Freudenberger .Supersaturated solid solution of niobium in copper by mechanical alloying[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2003(1/2):119-125.
[19]	J.H.Chung;J.S.Song;S.I.Hong .Bundling and drawing processing of Cu-Nb microcomposites with various Nb contents[J].Journal of Materials Processing Technology,2001(1/3):604-609.
[20]	Snoeck E;Lecouturier F;Thilly L et al.Microstructural studies of in situ produced filamentary Cu/Nb wires[J].Scripta Materialia,1998,38(11):1643.
[21]	S. I. Hong .MECHANICAL PROPERTIES OF Cu-Nb MICROCOMPOSITES FABRICATED BY THE BUNDLING AND DRAWING PROCESS[J].Scripta materialia,2000(8):737-742.
[22]	Thilly L et al.Size-induced enhanced mechanical properties of nanocomposite copper/niobium wires:Nanoindentation study[J].Acta Materialia,2002,50:5049.
[23]	郭中正,孙勇,段永华,周铖,彭明军.磁控溅射沉积Cu-Nb薄膜的特征及热退火的影响[J].稀有金属,2011(01):59-65.
[24]	刘国涛,孙勇,郭中正,吴大平,朱雪婷.磁控溅射Cu-Nb和Cu-Mo薄膜结构与性能[J].材料导报,2012(06):49-53.
[25]	Wang YC;Misra A;Hoagland RG .Fatigue properties of nanoscale Cu/Nb multilayers[J].Scripta materialia,2006(9):1593-1598.
[26]	张欣,张金钰,刘刚,张国君,孙军.Cu/Nb纳米金属多层膜延性及断裂行为的尺寸效应[J].金属学报,2011(02):246-250.
[27]	S.I. Hong;M.A. Hill .MICROSTRUCTURE AND CONDUCTIVITY OF Cu-Nb MICROCOMPOSITES FABRICATED BY THE BUNDLING AND DRAWING PROCESS[J].Scripta materialia,2001(10):2509-2515.
[28]	Sauvage X et al.Solid state amorphization in cold drawn Cu/Nb[J].Acta Materialia,2001,49(03):329.
[29]	M.J. Demkowicz;L. Thilly .Structure, shear resistance and interaction with point defects of interfaces in Cu-Nb nanocomposites synthesized by severe plastic deformation[J].Acta materialia,2011(20):7744-7756.
[30]	Hong Sun I .Yield strength of a heavily drawn Cu-20%Nb filamentary micro-composite[J].Scripta Materialia,1998,39(12):1685.
[31]	Thilly T.;Ludwig O.;Lecouturier F.;Veron M. .Deformation mechanism in high strength Cu/Nb nanocomposites[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2001(0):510-513.
[32]	Misra A;Verdier M;Lu Y C et al.Structure and mechanical properties of CuX(X=Nb,Cr,Ni) nanolayered composites[J].Scripta Materialia,1998,39:555.
[33]	Spitzig W A .Strength in heavily deformation processed Cu20%Nb[J].Acta Metallurgica Et Materialia,1991,39:1085.
[34]	Karasek K R;Bevk J .Normal-state resistivity of in situ formed ultrafine filamentary Cu-Nb composites[J].Journal of Applied Physics,1981,52:1370.
[35]	Spitzig W A;Downing H L;Laabs F C et al.Strength and electrical conductivity of a deformation-processed Cu-5 pct Nb composite[J].Metallurgical and Materials Transactions,1993,24A:7.
[36]	N.A. Mara;T. Tamayo;A.V. Sergueeva;X. Zhang;A. Misra;A.K. Mukherjee .The effects of decreasing layer thickness on the high temperature mechanical behavior of Cu/Nb nanoscale multilayers[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2007(6):3241-3245.
[37]	漏卫娟 .纤维复合Cu2 Ag合金组织与导电性能的关系[D].杭州:浙江大学,2006.
[38]	Verhoeven J D;Chumbley L S et al.Measurement of filament spacing in deformation processed Cu-Nb alloys[J].Acta Metallurgica Et Materialia,1991,39(11):2825.
[39]	Karasek K R;Bevk J .Normal-state resistivity of in situ formed ultrafine filamentary copper-niobium compsites[J].Applied Physics,1981,52(03):1370.
[40]	D. Raabe .Simulation of the resistivity of heavily cold worked Cu-20 wt.%Nb wires[J].Computational Materials Science,1995(3):402-412.
[41]	Lima A L;Zhang X;Misra A et al.Length scale effects on the electronic transport properties of nanometric Cu/Nb multi-layers[J].Thin Solid Films,2007,515:3574.

上一张下一张

计量

下载量()
访问量()

作者相关

文章评分

您的评分：
1

0%
2

0%
3

0%
4

0%
5

0%

材料期刊网

高强度、高导电性Cu-Nb微观复合材料的研究进展

Research Progress on Cu-Nb Micro-composites with High Strength and Conductivity

参考文献