首次采用二氰二胺的N,N二甲基甲酰胺(DMF)溶液做沉积液,用Si(100)和ITO导电玻璃做基底,在阴极上电化学沉积了CNx薄膜.X射线衍射(XRD)花样说明沉积的CNx薄膜为非晶结构.X射线光电子能谱(XPS)、傅立叶转换红外光谱(FTIR)分析结果表明CNx样品薄膜的N/C比为0.7左右,碳和氮主要以C-N、C=N的形式成键,有少量的碳和氮以C≡N的形式成键.电阻率测试显示,样品具有较高的电阻率,Si(100)和ITO导电玻璃基底上氮化碳薄膜的电阻率值范围分别为1011～1012Ω*cm和1012～1013Ω*cm.用Si(100)、ITO导电玻璃两种衬底,CNx薄膜的沉积速率、N含量和电阻率不同,说明衬底的选择对沉积过程和沉积膜的性能有重要影响.
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