半导体技术的持续进步使片间信号传递效率成为影响整机性能的瓶颈.多芯片组件等高密度封装作为解决方案,要求封装材料具有高频低损耗、低介电常数和良好的机械性能.CaO-B2O3-SiO2系可析晶玻璃材料能够满足这些要求,并引起了人们极大的关注与研究.综述了近年来针对CaO-B2O3-SiO2系可析晶玻璃材料的技术难点、制备工艺、掺杂剂和热分析方法等多方面研究进展.提出了该体系材料需要进一步解决的问题.
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