采用放电等离子烧结法(SPS)制备了Diamond/Al复合材料,研究了金刚石粒径、成分配比、工艺参数等对复合材料的导热性能的影响.结果表明,SPS可以得到导热性能较好的Diamond/Al复合材料,致密度是影响该材料导热性能的最重要因素.在实验确定的金刚石体积分数50%,金刚石粒径70μm,温度550℃、压力30MPa的工艺条件下,所制备的材料致密度较高,热导率为182W/(m·K),比相同条件下纯铝粉烧结体的热导率提高了34.8%,表明金刚石的添加对烧结铝基材料导热性能有明显的改善作用.
参考文献
| [1] | Zhang Q,Li S D.Recent achievements in research forelectronic packaging substrate materials[J].Material Science& Technology,2000,8(4):66-72. |
| [2] | 褚克,贾成厂,尹法章,等.高体积分数SiCP/A1复合材料电子封装盒体的制备[J].复合材料学报,2006,23(6):108-113.Chu Ke,jia Chengchang,Yin Fazhang,et a1.Fabrication onelectronic package box of SiCp/A1 composites with highvolume fraction of SiCe[J].Acta Materiae Compositae Sinica,2006,23(6):108-113. |
| [3] | 张强,陈国钦,姜龙涛,武高辉.两种粒径颗粒混合增强铝基复合材料的导热性能[J].复合材料学报,2005,22(1):47-51.Zhang Qiang,Chen Guoqin,Jiang Longtao,Wu Gaohui.Thermal conduction properties of aluminum matrix compositesreinforced with dual-sized particles[J].Aeta MateriaeCompositae Sinica,2005,22(1):47-51. |
| [4] | 郑小红,胡明,周国柱.新型电子封装材料的研究现状及展望[J].佳木斯大学学报:自然科学版.2005.23f 3):138-142.Zheng Xiaohong,Hu Ming.Zhou Guozhu.Status andprospects of new materials for electric packing[J].Journal ofJiamusi University,2005,23(3):138-142. |
| [5] | 曲寿江.耿林,曹国剑,等.挤压铸造法制备可变形SiCe/Al复合材料的组织与性能[J].复合材料学报,2003.20(3):72 76.Qu Shoujiang,Geng Lin,Coo Guojian,et a1.Micro structureand properties of deformable SiCP/Al composite fabricatedbysqueeze casting met hod[J].Acta Materiae CompositaeSinica,2003,20(3):72-76. |
| [6] | 张大童,李元元,龙雁.铝基复合材料的研究进展[J].轻合金加工技术,2000(1):5-9.Zhang Datong,Li Yuanyuan,Long Yan.A review on theprogress of aluminium matrix composites[J].Light AlloyFabrication Technology.2000(1):5-9. |
| [7] | 亓曾笃.人造金刚石散热材料EJ].超硬材料工程,2006,18(2):42-43.Qi Zengdu.Diamond heat spreader[J].Superhard MaterialEngineering,2006,18(2):42 43. |
| [8] | Ruch P W,Beffort O,Kleiner S,et a1.Selective interfacialbonding in A1(Si)一diamond composites and its effect onthermal conductivity[J].Composites Science andTechnology,2006,66:2677-2685. |
| [9] | Beffort O,Khalid F A,Weber L,et a1.Interface formation ininfiltrated A1(Si)/diamond composites[J].Diamond&Related Materials.2006,1 5:1 250-1260. |
| [10] | 罗锡裕.放电等离子烧结材料的最新进展[J].粉末冶金工业,2001,11(6):7-16.Luo Xiyu.Current progress of materials produced by sparkplasma sintering[J].Powder Metallurgy Industry,2001,11(6):7-16. |
| [11] | 桂立丰.机械工程材料测试手册[M].沈阳:辽宁科学技术出版社,1996:226. |
| [12] | 黄培云.粉末冶金原理[M].北京:冶金工业出版社,1997:285-286. |
| [13] | 邓福铭.超高压高温烧结中金刚石表面石墨化过程再研究[J].高压物理学报,2001,15(3):235-239.Deng Fuming.Graphitization process of diamond surfacesduring the sintering of diamond-cobalt system under highpressure and temperature[J].Chinese Journal of HighPressure Physics,2001,15(3):235-239. |
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