铜在甲胺-铁氰化钾化学机械抛光液中的腐蚀与钝化

功能材料, 2004, 35(3): 392-394.

铜在甲胺-铁氰化钾化学机械抛光液中的腐蚀与钝化

何捍卫 ^1, , 胡岳华 ^2, , 周科朝 ^3, , 熊翔 ^4,

1.中南大学,粉末冶金国家重点实验室,湖南,长沙,410083

2.中南大学,资源加工与生物工程学院,湖南,长沙,410083

3.中南大学,粉末冶金国家重点实验室,湖南,长沙,410083

4.中南大学,粉末冶金国家重点实验室,湖南,长沙,410083

基金项目: 国家自然科学基金(59925412)

关键词：铜 , 化学机械抛光液 , 腐蚀与钝化

Corrosion and passivation of copper in the CMP slurry of CH3NH2-K3 [ Fe( CN )6 ]

用电化学测试技术研究了腐蚀介质和成膜剂浓度对铜表面的腐蚀与钝化成膜的影响,分析了钝化膜的成分,探讨了钝化膜在抛光压力和转速作用下的磨损与表面再钝化的行为,测量了铜在化学机械抛光过程中的极化曲线.结果表明铜在甲胺溶液介质铁氰化钾抛光液中易钝化,钝化膜的主要成分为Cu4[Fe(CN)6],有少量Cu2O存在.钝化膜的磨损特性随成分浓度不同而不同.钝化膜的磨损难易程度与钝化膜的本身特性、抛光压力及转速有关.抛光过程中因钝化膜被磨损,腐蚀加快,腐蚀电流密度大幅增加.配方0.1%甲胺溶液+0.5%K3Fe(CN)6+5%Al2O3可行.

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铜在甲胺-铁氰化钾化学机械抛光液中的腐蚀与钝化

Corrosion and passivation of copper in the CMP slurry of CH3NH2-K3 [ Fe( CN )6 ]

参考文献