介绍了用于制备超细、纳米晶CuCr触头材料的热压、热等静压、爆炸烧结、热挤压、场辅助烧结和超高压烧结等压力烧结工艺,分析了这些烧结技术用于制备超细、纳米晶CuCr材料中亟待解决的问题,提出了添加高性能晶粒长大抑制剂的新思路.
参考文献
[1] | RiederWF;Schussek M;Giatzle W et al.TheinfluenceofcompositionandCrparticlesiteofCu-Crcontactsonchoppingcurrent,contactresistanceandbreakdownvoltageinvaccuminterrupters[J].IEEE Transactions on Components Packaging and Manufacturing Technology,1989,12(02):273. |
[2] | WangY;Ding B .ThepreparationandpropertiesofmicrocrystallineandnanocrystallineCuCrcontactmaterial[J].IEEE Transactions on Components Packaging and Manufacturing Technology,1999,22(02):467. |
[3] | MORRISDG;Morris M A .RapidsolidificationandmechanicalalloyingtechniquesappliedtoCuCralloys[J].Materials Science and Engineering,1988,104:201. |
[4] | Ballat J.;Konig D. .Insulation characteristics and welding behavior of vacuum switch contacts made from various CuCr alloys[J].IEEE transactions on electrical insulation. (Institute of Electrical and Electronics Engineers. Electrical Insulation Group). New York.,1993(4):628-634. |
[5] | 李秀勇,王亚平,丁秉钧.微晶、纳米晶CuCr触头材料的组织及性能[J].稀有金属,1999(05):362-365. |
[6] | 黄培云.粉末冶金原理[M].北京:冶金工业出版社,1997:332. |
[7] | 崔建国;杨志懋;丁秉钧 .微晶CuCr50真空断路器触头材料的研制[J].粉末冶金技术,1997,15(01):33. |
[8] | 王亚平;崔建国;杨志懋 等.微晶CuCr材料的制备及电击穿性能的研究[J].西安交通大学学报,1997,31(03):76. |
[9] | GERMANRM.Powder metallurgy science[M].Princeton:MetalPowderIndustriesFederation,1994:318. |
[10] | 吕大铭;凌贤野;周武平 等.用热等静压制取铜铬系真空触头材料[J].粉末冶金工业,1997,7(01):17. |
[11] | PRUMMERR;Blazynski T Z.Powder compactionexplosive welding forming and compaction[J].Applied Science New York NY,1983:369. |
[12] | 罗守靖,李金平,胡伟晔,龚朝晖,牛玮.后续烧结对爆炸压实CuCr合金性能的影响[J].材料科学与工艺,2001(01):81-84. |
[13] | 李金平,罗守靖,龚朝晖,牛玮,纪松.Explosive compaction of CuCr alloys[J].中国有色金属学会会刊(英文版),2002(05):841-844. |
[14] | S.W.Wang;L.D.Chen .Densification of Al_2O_3 powder using spark plasma sintering[J].Journal of Materials Research,2000(4):982-987. |
[15] | Joanna R. Groza;Antonios Zavaliangos .Sintering activation by external electrical field[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2000(2):171-177. |
[16] | 王强,梁淑华,范志康.CuCr系合金材料制造工艺的新进展[J].材料导报,2000(08):22. |
[17] | RoertsPR;Ferguson B L .Extrusionofmetalpowders[J].International Materials Reviews,1991,36:62. |
[18] | 梁忠友,王介峰,韩丽.纳米陶瓷成型、烧结方法研究进展[J].佛山陶瓷,2001(03):8-10. |
[19] | 周武平 等.铜铬铁真空触头组织的研究[J].机械工程材料,1994,18(02):43. |
[20] | 赵峰,杨志懋,丁秉钧.CuCr25W1Col合金的性能研究[J].稀有金属材料与工程,2000(01):57-60. |
[21] | 王江,张程煜,丁秉钧.加入Ni-Al,W-Ni,W-Co二元添加剂时的CuCr25合金的组织与性能[J].稀有金属材料与工程,2001(04):290-294. |
[22] | 张程煜,王江,张晖,丁秉钧.Ni或Co的加入对CuCr25合金组织与性能的影响[J].稀有金属材料与工程,2001(04):286-289. |
[23] | 王立彬,张程煜,丁秉钧.W或C添加剂对优化CuCr25合金显微组织的作用[J].稀有金属材料与工程,2003(01):41-44. |
[24] | C.Y.Zhang,Y.P.Wang,Z.M.Yang,B.J.Ding,Y.L.Li.MICROSTRUCTURE AND PROPERTIES OF CuCr25 ALLOYS WITH DIFFERENT Ni CONTENT[J].金属学报(英文版),2003(02):151-154. |
[25] | Zhang Chengyu;Ding Bingjun .Effects of additives W and Ni on microstructure and properties of CuCr25 materials[J].International journal of materials & product technology,2004(4):292-299. |
[26] | ZhangC;Wang Y;Yang Z et al.MicrostructureandpropertiesofvacuuminductionmeltedCuCr25alloys[J].Journal of Alloys and Compounds,2004,336(1-2):289. |
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