通过微合金化获取高性能多晶硅,研究了不同Sn掺入量对定向凝固多晶硅位错及少子寿命的影响.将高纯Sn掺入到精炼冶金级硅(UMG-Si)中,定向凝固多晶硅.研究发现,硅锭位错密度沿轴向分布为中间低,底部和顶部高.在晶体硅中掺入Sn后,不影响硅的电学性能,但明显减少硅锭的位错密度.当掺入Sn含量为20 ppmw、50 ppmw和100 ppmw时,硅锭平均少子寿命由未掺Sn硅锭的0.81μs分别增加至1.22 μs、1.47 μs和1.31μs.掺Sn可减少位错密度和增加少子寿命,归因于替代位的Sn原子引入晶格应力,Sn易捕获空位V形成Sn-V对,抑制间隙原子形核.
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