为了在PI(聚酰亚胺)薄膜上制备一种含银的紫外光(UV)固化化学镀铜活化浆料，采用电化学方法测定了聚酯丙烯酸酯和聚氨酯丙烯酸酯不同质量比得到的活化浆料引发化学镀铜的混合电位–时间曲线，研究了硝酸银和导电炭黑含量对活化浆料的附着力、催化活性及铜镀层导电性的影响，通过扫描电镜(SEM)、X射线能谱仪(EDS)和X射线衍射仪(XRD)对活化浆料和铜镀层的表面形貌、结构以及Ag元素分布等进行了研究。以聚酯丙烯酸酯和聚氨酯丙烯酸酯按质量比为4∶6组成复合预聚体，导电炭黑和AgNO3的用量分别为10%和7%制备活化浆料，将其涂覆在PI薄膜上，UV固化后化学镀铜10 min，所得镀铜层颗粒细小、致密，与基材的结合力达100%，方阻为0.046?/□。
In order to prepare a silver-containing UV-curable active paste for electroless copper plating on the surface of PI (polyimide) thin film, the mixed potentialvs. time curves for electroless copper plating initiated by the active pastes obtained from different mass ratios of polyester acrylate to polyurethane acrylate were determined by electrochemical method, and the influence of the contents of silver nitrate and conductive carbon black on the adhesion and catalytic activity of the active paste and the conductivity of the copper deposit were studied. The surface morphology, structure, and silver distribution of the active paste and copper deposit were examined by scanning electron microscope (SEM), energy-dispersive X-ray spectrometer (EDS), and X-ray diffractometer (XRD). The active paste prepared with polyester acrylate and polyurethane acrylate at a mass ratio of 4 to 6 as composite prepolymers, conductive carbon black 10%, and AgNO3 7% was coated on PI thin film and then cured under UV irradiation. The copper deposit obtained by electroless copper plating for 10 min thereafter is fine-grained and compact with a 100% adhesion to the substrate and a square resistance of 0.046?/□.
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