铝及铝合金的电镀一般需要浸锌和预镀处理,工艺复杂,镀层质量不易控制.为此,将铝及铝合金经化学和电化学前处理后,直接置于加有细化剂、稳定剂和阻氢剂的电镀液中施镀,采用电流密度为0.5～2.0 A/dm2的直流电源进行电镀,所得镀层均匀、致密、表面光滑、无起泡、起壳现象,镀层与铝基底具有良好的结合力.本工艺比传统工艺程序简单、易操作,镀层质量高.
Conventional process for lead electropLating of aluminum and its alloy is usually complex and needs pre- treatment such as galvanizing and pre-plating of copper or nickel. Thus Al and its alloy were chemically and electrochemically pretreated and then directly electroplated in a bath containing refiner, stabilizer, and anti-hydrogen agent, at a current density of 0.5 ～ 2.0 A/dm2 produced from a direct cur-rent power supply. Results indicate that the resulting Pb coating was uniform, compact, free of blister and shelling phenomenon and had good adhesion to substrate. In general, the present process is simple in terms of procedure and operation and the coating has satisfactory quality.
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