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以均苯四甲酸二酐(PMDA),4,4′-二氨基二苯醚(ODA)为单体,分别采用N,N-二甲基乙酰胺(DMAc)、DMAc/二甲苯为溶剂,制备了两种PI/SiO2纳米杂化薄膜,并对其微观结构、热稳定性、光学透明性、力学性能进行研究。结果表明:与采用DMAc为溶剂相比,当采用DMAc/二甲苯为溶剂时,SiO2粒子的粒径较小;PI/SiO2纳米杂化薄膜的热稳定性、透光性、强度及韧性均得到提高。

Using pyromellitic dianhydride(PMDA) and 4,4′-diaminodiphenyl ether(ODA) as monomer, N, N-dimethylacetamide(DMAc) and DMAc/dimethyl benzene as solvent respectively, two kinds of polyimide/silica(PI/SiO2) nano-hybrid films were prepared, and their micro structure, thermal stability, transparency and mechanical properties were studied. The results indicate that compared with DMAc as solvent, when using DMAc/dimethyl benzene as solvent, the size of silica particle is smaller, and the thermal stability, transparency, tensile strength and toughness of the PI/SiO2 hybrid film is improved.

参考文献

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[7] 牛颖,张明艳,董铁权,曾恕金.固体含量对聚酰亚胺/二氧化硅杂化薄膜热性能的影响[J].绝缘材料,2006(06):35-37,41.
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